Tiny holes machining on printed circuit board becames more and more difficult with the demand of small size, light weight, high density and good reliability of electrical equipments.
随着电器产品小型、轻量、高密度和高可靠性的要求，印刷电路极微孔加工的难度越来越大。
This paper studied the problems in machining tiny curved holes with electron beam. The concerned formulae were derived so as to provide the basis for machining of tiny cured holes.
本文对电子束加工微细弯孔的有关问题进行了研究，导出了相关的物理方程，为微细弯孔的加工提供了理论依据。
This paper studied the problems in machining tiny curved holes with electron beam. The concerned formulae were derived so as to provide the basis for machining of tiny cured holes.
本文对电子束加工微细弯孔的有关问题进行了研究，导出了相关的物理方程，为微细弯孔的加工提供了理论依据。
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