Sulfate tin plating process has been widely used in electroplating industry for its strengths such as high current efficiency, fast plating rate, low cost and easy effluent disposal.
硫酸盐光亮镀锡工艺具有电流效率高、沉积速度快、成本低及废水易处理等优点，在电镀生产中已广泛应用。
A new immersion plating process was developed in which copper sulfate and stannous sulfate were used as main salt, with addition of complex, brightener and stabilizer to tin salt.
采用硫酸铜、硫酸亚锡为主盐，加入络合剂、光亮剂、锡盐稳定剂，研究成功了一种新的浸镀铜锡合金工艺。
The process formula and flow of BH-411 bright sulfate tin plating, maintenance and management of the bath were introduced.
介绍了BH-411光亮硫酸镀锡的工艺配方、工艺流程和镀液的维护与管理，讨论了镀液中的硫酸、硫酸亚锡和添加剂的作用。
The process of electroless tin plating has wide applications in microelectronic filed.
化学镀锡工艺在微电子行业具有很好的应用前景。
A cyanide tin - copper plating process was optimized by means of orthogonal test. The effect of bath components of electrolytic solutions and electrodeposits was investigated.
采用正交试验研究了氰化镀铜锡合金工艺中各因素水平与镀液、镀层性能的关系，优选出一种最佳工艺配方。
Describes the process, operating hints for crystal-tin plating and stripping of the defective films.
阐述冰花镀锡的工艺流程、要点，以及不良镀层的退除。
The mechanism of electroless plating tin was investigated from displacement process and reduction process.
对化学镀锡的机理从置换过程和还原过程两个方面进行研究。
The lead-free nickel free white and bright nickel substitute plating process…bright nickel substitute tin salt 30g 666 lead-free nickel free white and …
批发采购电镀助剂-供应666无铅无镍光亮厚白铜锡（电镀助剂）批发…
Tin plating: Immediately after copper plating, a thin layer(0003") of tin is electroplated on the surface of the copper. Tin will act as an etch resist in a future manufacturing process."
镀锡：镀铜后在铜表面再镀上一层锡，大约3mil厚，在下工序中起到抗蚀保护线路的作用。
Understand Tin plating theory and process; understand chemical de-flash theory and process;
了解电镀原理，制程；了解化学去溢料原理，制程。
Understand Tin plating theory and process; understand chemical de-flash theory and process;
了解电镀原理，制程；了解化学去溢料原理，制程。
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