• Process modifications such as solder pot finishes for wave soldering equipment to avoid leaching issues are now available.

    避免出现浸析问题诸如设备焊锡槽终工艺修改目前已经完成

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  • Selective pallets shall not be used in conjunction with a no-clean wave solder process.

    可选择不能用于免洗的波峰流程中

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  • SOLDERABILITY: Wave solder, no wash.

    性:

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  • This study benchmarked the strength of solder joints formed through the Through - Hole Reflow process against the traditional wave soldered joint.

    波峰工艺焊点强度标准,研究在不同钎料量下通再流焊点的强度。

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  • Used in the masking operation during wave solder process on PCB, prevented electroplating liquid immersing and polluting.

    适用PC b板过程中遮蔽金手指部分防止镀液浸入及污染。

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  • Suit for reflow and wave flow solder.

    适应波峰焊。

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  • We owns various advanced production facility and inspection equipment, such as wave crest solder, hot wind flow solder, ultrasonic and full-automatic switch power supply test instrument.

    公司拥有各种先进生产设备检测设备进口波峰、全热风回流焊、超声波及全自动开关电源测试仪。

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  • Used in the masking operation during wave solder process on PCB.

    印刷电路板镀金遮蔽保护用

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  • Two ways for preheating as wave solder, IR or hot air convection.

    两种方式进行预热,红外热风。

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  • Two ways for preheating as wave solder, IR or hot air convection.

    两种方式进行预热,红外热风。

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