The process variation accounts for deviations in the semiconductor fabrication process.
工艺参数的变异导致半导体制造过程的偏差。
The gate length may be larger than the minimum specified by semiconductor fabrication design rules.
栅极长度可以比半导体制造设计规则所指定的最小值大。
After an analysis of the process of semiconductor fabrication, a proposal of the wafer dicing using micro-abrasive waterjet is put forward.
通过对半导体加工工艺的分析研究，提出了用磨料水射流切割半导体材料，包括晶圆的切割、芯片的终端封装切割。
There, he and his colleagues devised a scheme to marry photolithography, a technology used in semiconductor fabrication, to combinatorial chemistry.
正是在那，他与他的研究人员一起将用于半导纤维的技术-影像平面印刷技术与组合化学嫁接到了一起。
Some users are foundry operators, who operate the semiconductor fabrication facilities and design-service companies who use EDA software to evaluate an incoming design for manufacturing readiness.
一些使用EDA 软件的半导体制造公司和设计服务公司，用EDA软件为制造准备工作做设计评估。
It provides comprehensive wafer fabrication services and technologies to semiconductor supplier and system companies.
它提供了全面的半导体晶圆制造服务、技术供应商和系统公司。
Fabrication process of some kind semiconductor photodetectors are presented. Device characteristics and their applications are reviewed.
本文将介绍几种半导体光电探测器的研制工艺、器件特性及其应用举例。
According to the characteristics of dynamic bottleneck in semiconductor wafer fabrication system (SWFS), a dynamic bottleneck real-time dispatching (DBRD) strategy was proposed.
针对半导体晶圆制造系统中瓶颈设备动态漂移的特性，提出一种动态瓶颈实时派工策略。
A method for improving the critical dimension uniformity of a patterned feature on a wafer in semiconductor and mask fabrication is provided.
一种在半导体与罩幕制造中改善晶圆上的图案化特征结构的临界尺寸均匀性的方法。
The experimental results indicate that such polymer gratings have promising potentials for the fabrication of low-order DFB organic semiconductor lasers.
实验结果显示这种聚合物光栅在制作低次分布反馈有机半导体激光器中有潜在的应用。
The invention discloses a process for preparing a well of a semiconductor device, which relates to the fabrication technology of a former semiconductor.
本发明公开了一种半导体器件阱的制造方法，涉及半导体前道的制造工艺。
SRB was verified on three different scale semiconductor wafer fabrication facilities simulation models by applying various dispatching rules on non-batch processing machines.
基于三种不同规模的半导体生产线模型，在非批加工设备使用不同的调度规则的情况下，对提出的SRB进行了仿真验证。
A new agent-based dynamic scheduling approach for semiconductor wafer fabrication was proposed, which integrated release control, dispatching and machine preventive maintenance scheduling.
基于智能体技术，提出了芯片制造生产线动态调度新方法，实现了投料调度、工件调度与设备维护调度的集成。
Most of the fabrication methods of silicon single-electron transistors can be perfectly compatible with the si complementary metal-oxide-semiconductor (CMOS) technology.
大多数硅基单电子晶体管的制备方法可以很好地与主流的CMOS工艺兼容。
Fabrication of Reflective Layer on Semiconductor Light emitting diodes.
在半导体发光二极管上制造反射层。
Fabrication of Reflective Layer on Semiconductor Light emitting diodes.
在半导体发光二极管上制造反射层。
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