Sometimes we use it to describe the relative power level between things.
有些时候我们用以描述不同东西的相对强度。
Relative to the semiconductor industry, ANSYS Icepak can import variable die power data from partner die-level design tools.
对于半导体产业，ANSYS 热分析软件Icepak可以读入晶片级设计工具所产生的动态晶片功率数据。
Expectation of position is analyzed upon following logics:First of all, stand on a relative higher level, has power of comprehensive control;
而对于期望获得理想得“位置”，则基于以下的逻辑来分析：首先，必须居于较高的层级，有统筹调度之“势”；
Expectation of position is analyzed upon following logics:First of all, stand on a relative higher level, has power of comprehensive control;
而对于期望获得理想得“位置”，则基于以下的逻辑来分析：首先，必须居于较高的层级，有统筹调度之“势”；
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