Table listed cathodic current density and average load in different plating solutions, thereby tank size was calculated.
列表说明各镀种阴极电流密度、平均装载量等数据，由此计算所需设置的镀槽尺寸。
The sources of iron impurities were investigated and some effective methods were proposed to remove the iron impurities from plating solutions.
分析了铁杂质的来源并提出了几种去除铁杂质的方法。
Properly formulated plating solutions containing the right size particles dispersed in a suitable medium provide low coefficient of surface friction with outstanding wear resistance.
适当配比的镀液，加入拉径正确而又分散于适宜介质内的微粒，可提供表面摩擦系数低、耐磨性优异的镀层。
Summarizes continuous plating processes for electronic connector assemblies including gold, palladium and, tin plating solutions, properties of the films, and continuous plating equipment.
综述了接插件连续镀金、、的电镀工艺，包括设备、液和镀层性质。
Summarizes continuous plating processes for electronic connector assemblies including gold, palladium and, tin plating solutions, properties of the films, and continuous plating equipment.
综述了接插件连续镀金、钯、锡的电镀工艺，包括设备、镀液和镀层性质。
The initial stages of the electrocrystallization of zinc onto vitreous carbon from chloride zinc-plating solutions were investigated using linear sweep voltammetry and potential step method.
线性扫描伏安法和电位阶跃法被用来研究氯化钾镀锌溶液中锌在玻璃碳上电结晶的初期阶段。
In one embodiment the immersion plating solutions of the invention also contain at least one inhibitor containing one or more nitrogen atoms, sulfur atoms, or both nitrogen and sulfur atoms.
在一个实施方案中，本发明的浸镀溶液还含有至少一种含一个或多个氮原子、一个或多个硫原子，或氮和硫原子两者的抑制剂。
For example, moldings that are to be electroplated, and will be subject to acid solutions during plating, must be made using very slow injection speeds to minimize surface orientation.
例如，要电镀的注塑件在电镀时会经受酸溶液，必须采用很低的注塑速度制造以使表面方向性最小化。
A cyanide tin - copper plating process was optimized by means of orthogonal test. The effect of bath components of electrolytic solutions and electrodeposits was investigated.
采用正交试验研究了氰化镀铜锡合金工艺中各因素水平与镀液、镀层性能的关系，优选出一种最佳工艺配方。
A cyanide tin - copper plating process was optimized by means of orthogonal test. The effect of bath components of electrolytic solutions and electrodeposits was investigated.
采用正交试验研究了氰化镀铜锡合金工艺中各因素水平与镀液、镀层性能的关系，优选出一种最佳工艺配方。
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