The welding quality of the solder joint on the conducting wire connected with the soldering cover and the PCB.
导线在接插件焊杯内的焊点和导线在印制板上的焊点的焊接质量。
Thermal fatigue life of lead-free solder joint of Air-conditioner PCB (Printed Circuit Board) under the form of THT (Through Hole Technology) is studied.
本文对空调器印刷电路板(PCB)通孔插装形式无铅焊点的热疲劳寿命进行了研究。
It should be payed much attention to fast cooling because it can decrease the defects of PCB assemblies and promote the reliability of solder joint.
研究现状表明快速冷却有助于减少焊接缺陷，提高焊点可靠性。
For increased reliability, a reduced CTE (coefficient of thermal expansion) mismatch with the PCB reduces the possibility of solder-joint cracks resulting from thermal cycles.
为提高可靠性，降低的热膨胀系数(热膨胀系数)的不匹配与PC B减少了从热循环所得的焊点的裂缝的可能性。
The study about board level drop impact shows that: (1) The mechanical impact and bending of PCB are the main reasons which induce the solder joint stress even the drop failure;
研究结果表明，在跌落冲击条件下：（1）PCB的机械冲击和弯曲变形是导致焊点应力甚至跌落失效的主要原因；
The study about board level drop impact shows that: (1) The mechanical impact and bending of PCB are the main reasons which induce the solder joint stress even the drop failure;
研究结果表明，在跌落冲击条件下：（1）PCB的机械冲击和弯曲变形是导致焊点应力甚至跌落失效的主要原因；
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