The discharge of circuits' parasitic capacitances leads to a high current spike during turning on.
由寄生电容引起的泄放电流在开通时产生很高的电流尖刺。
Thermally stimulated current is used to obtain the parameters of dielectrics, but the parasitic galvanic current existing in test influences the consequence.
热刺激电流测试中寄生电流的存在对测试结果会产生一定的影响。
Thermally stimulated current (TSC) is used to obtain the parameters of dielectrics, but the parasitic galvanic current existing in test influences the consequence.
热刺激电流测试(TSC)中寄生电流的存在对测试结果会产生一定的影响。
We try to obtain the common-base current gain a of the parasitic PNP transistor from the eloping profile of the collector region including the effect of buried-layer.
本文从包括埋层影响的集区杂质分布出发,求出了寄生PNP晶体管的共基极电流放大系数。
The calculated results also indicate that higher saturation current, transconductance, and cutoff frequency can be achieved by lowering the parasitic resistances.
降低寄生源漏电阻可以获得更高的饱和电流、跨导和截至频率。
Owing to the connection of the main current path and the gate driving path in discrete form, the influence of parasitic inductance can be reduced and voltage conversion efficiency can be improved.
由于以分 立的形式连接主电流通路和栅极驱动通路,因此可以减小寄生电感的影响,并提高电压变换效率。
Buffer resistance R6: playing buffer effect on spark discharge current and hindering. The parasitic vibration brought by LC distributing parameters of high-voltage output loop.
阻尼电阻r 6:对火花放电电流起缓冲作用,并阻尼高压输出回路中lc分布参数引起的寄生振荡。
In this paper, the mechanism of TSC and parasitic conduction current is discussed.
热刺激电流测试(TSC)中寄生电流的存在对测试结果会产生一定的影响。
Considering the issues such as current density, parasitic, symmetry, antenna effect and ESD.
设计中考虑到电流密度问题,寄生问题,对称性问题,天线效应以及ESD保护等。
An equation to describe the parasitic galvanic current in experimental TSDC is proposed.
提出了可描述TSDC中寄生电流的方程。
In order to get beam steering, the switches control the states of the parasitic monopoles to change their impedance and current distribution.
为了实现波束可控,可用开关控制无源单极子的接地状态来改变其阻抗和电流分布。
The novel LDMOSFET did not degrade the advantage of SOI structure's low leakage current and parasitic capacitance, which also suppressed the self-heating effects and floating body effects.
工艺和性能模拟分析表明,此结构具有SOI器件低泄漏电流和低输出电容的特性,而且能抑制自加热效应和浮体效应。
The grounding current EMI is caused by charging and discharging of the parasitic capacitances between the circuit and ground during the switching instant devices.
地电流干扰主要是由于半导体器件开关动作产生的快速上升和下降的开关电压作用在对地电容上产生的位移电流形成的。
But there are also some disadvantages, such as the reducing of drain current driving capability and the increasing of parasitic capacitance.
但同时也有一些不足,如漏极驱动能力降低以及寄生电容增大的问题。
Imperfections in the board's dielectric properties can provide parasitic-leakage-current paths.
电路板介电性能的缺陷会给寄生漏电流提供路径。
Imperfections in the board's dielectric properties can provide parasitic-leakage-current paths.
电路板介电性能的缺陷会给寄生漏电流提供路径。
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