This product can be used for building template components, building beams, carriage board, furniture, floor, room decorate wooden keel and packing material, such as wide range of applications.
本产品可用于构建模板组件，建筑梁、车厢板，家具，地板，房间装修木龙骨和包装材料，如广泛的应用程序。
The board prepared could be used as packing material for exports, especially be suitable for tobacco industry.
所制备的板材可供出口包装材料用，特别适用于烟草工业。
The company's main all kinds of carton, special board, paper tray etc packing materials. Integration.
公司主营各类纸箱，特殊纸板，纸质托盘等整合包装材料。
Besides the application scope of single wall and double wall corrugated board, the triple wall product is mainly used as motorcycle packing material.
除了具有三层和五层瓦楞纸板的应用特性外，七层瓦楞纸板主要用于摩托车的包装。
Widely applies in the piano, acoustic, the packing, the windows and doors, the industrial art, professions and so on electronic circuit board, indoor outside repair.
广泛应用于钢琴、音响、包装、门窗、工艺美术、电子线路板、室内外装修等行业。
Our leading products are involved in wood floor board for warehouse, export stack plate, pallet, moistureproof rack, packing case and so on.
我公司以生产各种规格垫仓板、出口栈板、托盘、铲板、防潮货架、包装箱等为主导产品。
The packing component is used for packing products, and the packing component comprises a bottom board, a plurality of first buffer parts and a plurality of second buffer parts.
包装组件用于包装产品，该包装组件包括底板、多个第一缓冲件及多个第二缓冲件。
The utility model relates to a low foaming reinforced composite plastic board used for packing components such as a steel coil and a steel plate.
本实用新型涉及一种用于包装钢卷和钢板等构件的低泡增强复合塑料板。
This finished product, single wall corrugated board, is mainly introduced as inner packing material.
三层瓦楞纸板，主要用作内包装材料，也可以用于小而轻的产品的外包装。
The utility model relates to accessories of packing machine, in particular to a bar tie wire board for packing machine.
本实用新型涉及打包机附件，特别涉及一种打包机扣丝板。
The coating has excellent solder properties and can be used on the surfaces of printed circuit board and patch-like electronic apparatus in order to carry out lead-free electronic packing.
该镀层的可焊性优良，可作为印刷电路板和元器件的表面镀层，从而实现电子封装的无铅化。
The coating has excellent solder properties and can be used on the surfaces of printed circuit board and patch-like electronic apparatus in order to carry out lead-free electronic packing.
该镀层的可焊性优良，可作为印刷电路板和元器件的表面镀层，从而实现电子封装的无铅化。
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