Further more, the increase of B reduced greatly the touching off and keeping discharge voltages during magnetron sputtering coating, which gives another approach to lower voltage magnetron sputtering.

此外，B的增加显著降低了磁控溅射镀膜工艺的着火电压和维持放电电压，为实现低电压磁控溅射提供了另外一种思路。

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Further more, the increase of B reduced greatly the touching off and keeping discharge voltages during magnetron sputtering coating, which gives another approach to lower voltage magnetron sputtering.

此外，B的增加显著降低了磁控溅射镀膜工艺的着火电压和维持放电电压，为实现低电压磁控溅射提供了另外一种思路。

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