The pressure differential generates a lift force that supports the wafer below the head portion (54) of the wand in a substantially non-contacting manner, employing the Bernoulli principle.
该压力差生成以基本非接触的方式支撑该棒的头部部分(54)下面的晶片的抬升力,其采用了伯努利定理。
The pressure differential generates a lift force that supports the wafer below the head portion (54) of the wand in a substantially non-contacting manner, employing the Bernoulli principle.
该压力差生成以基本非接触的方式支撑该棒的头部部分(54)下面的晶片的抬升力,其采用了伯努利定理。
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