The invention relates to polyphenyl methylsiloxane modified epoxy resin and a manufacturing method of an electronic packaging material thereof.
本发明涉及聚苯基甲基乙氧基硅烷改性环氧树脂及其电子封装材料的制法。
The invention relates to polyphenyl methylsiloxane modified epoxy resin and a manufacturing method of an electronic packaging material thereof.
本发明涉及聚苯基甲基乙氧基硅烷改性环氧树脂及其电子封装材料的制法。
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