A compact ECR plasma source, the strengths of which are its ultra low electron temperature, its low pressure and its ultra low density, was developed and built for such a simulator.
本文就是为空间电离层环境模拟器研制的扩散型极低气压、低电子温度和极低密度的紧凑型电子回旋共振等离子体源的研制。
Helicon plasma is a kind of high density, low temperature plasma in low pressure.
螺旋波等离子体是一种高密度的低温低气压等离子体。
The low pressure plasma technology and coating equipment were introduced.
介绍了低压等离子体技术及其涂层设备。
Using this interferometer, the time variation of the average electron density of a low pressure pulsed plasma has been measured and the experimental result is quite satisfactory.
用此干涉仪测量了低气压脉冲放电产生的冷等离子体的平均电子密度随时间的变化，取得了较为满意的结果。
Adecomposition of silane and NF3 by low pressure plasma and waste as treatment by non-thermal discharge plasma are discussed.
用低压等离子体分解硅烷和NF 3以及用放电等离子体处理汽车等的排入废气。
The gas and liquid filter media treated by low pressure plasma technology have good quality and low production cost.
用低压等离子体技术对气体和液体过滤介质进行处理，可提高过滤介质的质量且可降低生产成本。
The surface modification of 316 austenitic stainless steel has been investigated by plasma-based low-energy ion implantation apparatus at various temperatures and working atmospheric pressure.
采用等离子体基低能离子注入装置在不同注入温度、气压条件下氮离子注入316奥氏体不锈钢。
Special consideration was given to the collision-free stochastic heating of the low pressure plasma.
在计算过程中，考虑了低气压等离子体无碰撞随机加热机制的作用。
The results indicate that the wear loss of WC - co coating plasma-sprayed at low-pressure is less than that in air.
结果表明：低压等离子喷涂涂层的滑动磨损量小于空气等离子喷涂涂层。
Low pressure plasma technology and the device for surface treatment were introduced in the article.
介绍了低压真空等离子体技术及表面处理设备。
Plasma in a pulsed discharge in water (PPDW) has the character of high pressure, high density and low temperature, low ionized degree.
水中放电等离子体(PPDW)具有高压、高密度和低温、低电离度的特点，人们对其辐射是否具有黑体辐射的特点一直观点不一。
We study effects of low-pressure and air pressure plasma processing parameters in treating PVA films and desizing process of cotton fabric.
以上浆织物为研究对象时，强力和芯吸高度也逐渐增大，退浆率也随着等离子处理时间的延长而增大。
Plasma systems 400 and 660 are low-pressure microwave plasma systems for cleaning advanced chip packages prior to die attach, wire bond and encapsulation.
等离子体400和660系列是低压微波等离子体应用于提高模具粘合，引线的焊接，特别是清洗高级的芯片封装。
Plasma systems 400 and 660 are low-pressure microwave plasma systems for cleaning advanced chip packages prior to die attach, wire bond and encapsulation.
等离子体400和660系列是低压微波等离子体应用于提高模具粘合，引线的焊接，特别是清洗高级的芯片封装。
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