The heat sink is in thermal contact with the integrated circuit package to extract heat during operation.
散热片与集成电路封装热接触用于在工作过程中提取热量。
The invention involves the integrated circuit package domain, to be specific, involves when galvanizes to the base pin, prevents the permutation reaction the method.
本发明涉集成电路封装领域，具体地说，涉及对管脚电镀时，防止置换反应的方法。
This kind of bag applies to package electronic products with moisture-proof requirement: such as PC boards, IC integrated circuit, CD driver, hard disk and electron component parts... etc.
适用于有防潮要求的电子产品包装：各类PC板、IC集成电路、光驱、硬盘、电子元器件等。
A package for mounting an integrated circuit chip to a circuit board or the like is provided.
提供在电路板等上安装集成电路芯片的封装。
For an integrated chip (IC) to function, it needs to be connected to the package or connected directly to the printed circuit.
为了让IC芯片发挥机能，就必需连接构装或直接连接印刷电路。
To improve the precision and efficiency of the integrated circuit (IC) package, a 2-dof high speed and high precision XY positioning table driven by voice coil actuator is presented.
针对一类音圈电机直接驱动的二自由度高速精密定位平台，为了在高速高加速情况下，获得良好的动态特性，对其动力学控制方法进行研究。
To improve the precision and efficiency of the integrated circuit (IC) package, a 2-dof high speed and high precision XY positioning table driven by voice coil actuator is presented.
针对一类音圈电机直接驱动的二自由度高速精密定位平台，为了在高速高加速情况下，获得良好的动态特性，对其动力学控制方法进行研究。
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