This paper introduces that we can reduce Within wafer nonuniformity (WIWNU) to achieve part and full planarization by distributing the speed of polishing head and polis.
介绍了在化学机械抛光过程中，可以通过抛光头与抛光台运动速度关系优化配置，降低晶片表面不均匀度，从而更好地实现晶片局部和全局平坦化。
Body Styles Tapped full lug or wafer.
阀体类型可钻孔的全凸耳或对夹式。
Wafer-level, laser-trimmed, thin-film resistors and temperature-compensated NMOS switches assure operation over the full operating temperature range with exceptional lin- ear and gain stability.
晶圆级，激光微调，薄膜电阻和温度，真实姿态补偿NMOS管开关保证在整个工作温度和特殊林耳和经营范围的增益稳定性。
Wafer-level, laser-trimmed, thin-film resistors and temperature-compensated NMOS switches assure operation over the full operating temperature range with exceptional lin- ear and gain stability.
晶圆级，激光微调，薄膜电阻和温度，真实姿态补偿NMOS管开关保证在整个工作温度和特殊林耳和经营范围的增益稳定性。
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