The sensing element and the measuring ASIC are assembled in a dual-in-line (DIL) plastic package with pins for surface mount and re-flow soldering.
加速度计的敏感元及测量专用芯片（ASIC） 集成在DIL塑料封装内，其引脚可用于表面安装和回流焊接。
The sensing element and the measuring ASIC are assembled in a dual-in-line (DIL) plastic package with pins for surface mount and re-flow soldering.
加速度计的敏感元及测量专用芯片（ASIC） 集成在DIL塑料封装内，其引脚可用于表面安装和回流焊接。
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