• An IC chip is mounted by flip chip or wire bonding or adhesive connection on the face of the metal substrate which has the dielectric coating thereon.

    IC芯片倒装焊接金属线焊接或粘贴连接安装于金属基片介质涂层表面

    www.bogu6688.com

  • An IC chip is mounted by flip chip or wire bonding or adhesive connection on the face of the metal substrate which has the dielectric coating thereon.

    IC芯片倒装焊接金属线焊接或粘贴连接安装于金属基片介质涂层表面

    www.bogu6688.com

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