• The process of flip chip based on aluminum nitride is studied.

    研究了为基倒扣封装工艺

    dict.cnki.net

  • The dynamics of ultrasonic transducer for thermosonic flip chip bonding is investigated.

    研究了热超声倒装合设备核心执行机构——能系统的动力学特性

    www.dictall.com

  • The embedded active chip also can be realized by backside thinning and flip chip bonding.

    通过芯片进行背面减薄倒装连接,可以实现有源芯片的嵌。

    dict.cnki.net

  • Flip chip technology has become one of the major joining technologies in electronic packaging.

    摘要覆技术成为电子主要接合技术之一

    www.websaru.com

  • Flip chip technology has become one of the major joining technologies in electronic packaging.

    技术成为电子主要接合技术之一

    danci.911cha.com

  • Flip Chip on Board (FCOB) has been used widely as a microelectronics packaging structural form.

    倒装芯片(FCOB)作为一种微电子封装结构形式得到了广泛的应用。

    www.dictall.com

  • The system can process wafers up to 200mm in diameter and includes die inversion for flip chip applications.

    系统可以处理直径多达200毫米的晶片,包括模具倒装

    www.e-gtm.com.cn

  • This article presents acid could be used to wash the indium bumps before flip chip bonding, based on indium oxide dissolved in acid.

    利用氧化易于溶于酸性溶液的性质,提出了在倒装焊接之前使用酸性溶液铟柱进行酸洗。

    www.dictall.com

  • This paper talks about the major supporting technologies for MCM package: the Interlinkage of Chips, Flip Chip Bonding, Flip Bonding.

    论文研究了MCM芯片安装互连芯片倒装焊接及其关键支撑技术等内容。

    dict.cnki.net

  • Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.

    集成电路倒装芯片封装半导体芯片载体之间形成可靠联接所用焊料中的

    www.cgets.net

  • Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.

    集成电路倒装芯片封装半导体铸模载波器的焊料中的

    www.wtoqc.cn

  • An IC chip is mounted by flip chip or wire bonding or adhesive connection on the face of the metal substrate which has the dielectric coating thereon.

    IC芯片倒装焊接金属线焊接或粘贴连接安装于金属基片介质涂层表面

    www.bogu6688.com

  • Thedrain saturation current is increased 10% after bonding. To disperse heat of GaNHEMT, this flip chip bonding method seems to be simple and effective.

    实验结果表明,这种改进倒装焊技术可以使HEMT 器件的饱和漏极电流提高10%。

    dict.cnki.net

  • This paper introduces the forward trends of flip chip bonding, the essential kinds of bumps, fabrication technology and testing technology about qualities.

    介绍芯片倒装焊重要意义、发展趋势、基本焊球类型制作方法焊球质量的检测技术

    dict.cnki.net

  • Electromigration induced Cu dissolution in flip chip Packages The phenomenon of Cu dissolution induced by electromigration at flip chip solder joints is reported.

    封装中电迁移效应导致溶解现象本論文报导封装之焊点中电迁移所引起之铜垫层快速溶解现象。

    www.docin.com

  • With the Doppler laser vibration measurement system, the vibration velocity curves of the flip chip and tool tip were obtained during thermo-sonic flip chip bonding.

    采用多普勒激光振动测量系统获得了热超声倒装键合过程工具末端芯片振动速度曲线

    dict.cnki.net

  • With optimized circuit design and bump layout, high performance transmission lines for flip chip packages can be achieved using dry film as the masking material for the bump plating.

    本实验显示经过最佳化传输线路设计凸块分布,低成本高效封装结构目标可以达成。

    dict.kekenet.com

  • The methods of 3d interconnection can be classified into the wire bonding, flip chip, through silicon via (TSV) and film wire technology, whose advantages and disadvantages are analyzed.

    实现3d互连方法分为引线键合倒装芯片通孔薄膜导线等,并对它们的优缺点进行了分析。

    lib.cqvip.com

  • The design describes the structure of compound die stamping flip-chip design and working process.

    本次设计阐述冲压倒装复合结构设计以及工作过程。

    blog.sina.com.cn

  • Chip scale package (CSP) for flip-chip on hard substrates and wafer re-distribution is studied, and its process flow is described.

    刚性基板倒装式和晶再分布式两种结构的芯片封装CSP进行了研究描述了CSP的工艺流程

    dict.cnki.net

  • And the important role of advanced packagings such as CSP, BGA and Flip-chip technology in the microelectronics is described as well.

    论述cspBGA倒装芯片等先进封装技术微电子工业中所发挥重要作用

    dict.cnki.net

  • In the article experiment prove:combination with feine tin-solder-bumps and underbump-metalliza with cobalt be able to longthen life of leadless flip-chip-solderng.

    文章通过试验证明:纯锡焊料凸块底部凸块金属焊层结合延长无铅焊接倒装片的寿命

    www.dictall.com

  • Underfill technology effectively enhances the flip-chip cycle fatigue life and reliability of packaging process.

    基 板上倒装芯片一般采用底部填充技术提高封装的可靠性

    www.iciba.com

  • Based on minimal energy principle, Evolving model of flip-chip 3-d shape prediction of MCM is established, and 3-d solder shape is effectively predicted.

    基于最小能量原理建立了多芯片组件(MCM)倒装焊焊点成形预测模型,对其三维焊点形态进行了有效预测。

    dict.cnki.net

  • Based on minimal energy principle, Evolving model of flip-chip 3-d shape prediction of MCM is established, and 3-d solder shape is effectively predicted.

    基于最小能量原理建立了多芯片组件(MCM)倒装焊焊点成形预测模型,对其三维焊点形态进行了有效预测。

    dict.cnki.net

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