• This paper introduces the forward trends of flip chip bonding, the essential kinds of bumps, fabrication technology and testing technology about qualities.

    介绍芯片倒装焊重要意义、发展趋势、基本焊球类型制作方法焊球质量的检测技术

    dict.cnki.net

  • The methods of 3d interconnection can be classified into the wire bonding, flip chip, through silicon via (TSV) and film wire technology, whose advantages and disadvantages are analyzed.

    实现3d互连方法分为引线键合倒装芯片通孔薄膜导线等,并对它们的优缺点进行了分析。

    lib.cqvip.com

  • The methods of 3d interconnection can be classified into the wire bonding, flip chip, through silicon via (TSV) and film wire technology, whose advantages and disadvantages are analyzed.

    实现3d互连方法分为引线键合倒装芯片通孔薄膜导线等,并对它们的优缺点进行了分析。

    lib.cqvip.com

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