The principle of eutectic bonding was analyzed. The fabrication process of eutectic bonding was discussed, the test result of eutectic bonding was given.
分析了金硅共晶键合的基本原理，讨论了键合实验的基本工艺，给出了键合的测试结果。
This paper reports on an RF MEMS package based on LTCC technology and gold-tin eutectic bonding, and also evaluates physical and RF characteristics of the proposed structure.
本文报告了一种基于低温共烧陶瓷技术和金锡共晶焊料的射频微机电的封装技术，并评估了该封装结构的物理及射频特性。
This paper reports on an RF MEMS package based on LTCC technology and gold-tin eutectic bonding, and also evaluates physical and RF characteristics of the proposed structure.
本文报告了一种基于低温共烧陶瓷技术和金锡共晶焊料的射频微机电的封装技术，并评估了该封装结构的物理及射频特性。
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