An epitaxial deposition process including a dry etch process, followed by an epitaxial deposition process is disclosed.
本发明提供一外延沉积工艺，其包含干式蚀刻工艺与后续的外延沉积工艺。
The most competitive technologies of transferring solid membrane mainly include bond and etch process and smart cut process.
最具竞争力的转移固体薄膜技术主要有键合加选择性腐蚀工艺和注氢智能剥离工艺。
Improvement of Dry ETCH process as the main means, and the improvement of the whole Aluminum ETCH flow as accessorial means. We want to get effective solution of Aluminum corrosion defect.
寻求以改善干法蚀刻的工艺为主要手段，通过改进整个铝金属工艺流程为辅助手段，能够有效的改善铝金属腐蚀的缺陷的解决方案。
Based on ash chamber of metal etch this paper describes the full process of dry clean development and evaluation.
本文以金属刻蚀去胶腔为背景，简述干刻清洗工艺开发和评价过程。
NITAL ETCH : Process of checking surfaces of ground product for cracks or burns by use of a series of acids and neutralizers.
硝酸酒精腐蚀检验：通过使用一系列的酸性或中性溶液检查磨削后零部件表面是否有裂痕或磨削烧伤。
Etch - a process of chemical reactions or physical removal to rid the wafer of excess materials.
蚀刻-通过化学反应或物理方法去除晶圆片的多余物质。
Application of TMAH solutions which is used as etchant in boron etch-stop and anisotropic etching process in the manufacturing of single-crystal and polysilicon pressure sensors is mainly discussed.
介绍了四甲基氢氧化铵(TMAH)溶液的腐蚀特性，论述了在单晶硅和多晶硅高温压力传感器的制作过程中，TMAH腐蚀液在浓硼终止腐蚀和各向异性硅杯腐蚀两个制作工艺中的应用。
The feasibility of using traditional dry-etch BARCs is very questionable because they introduce more process complexity and more defectivity and potentially cause unnecessary substrate damage.
传统的干法刻蚀不适合用于注入层，因为它的工艺复杂而且在刻蚀过程中可能导致基片损坏。
In the paper, effects of brown oxide process parameters on micro-etch rate, surface topography, surface roughness, binding strength were analyzed through the experiment.
本文分析了棕化工艺参数对微蚀速率、表面形貌 、表面微观粗糙度、结合力的影响 。
Tin plating: Immediately after copper plating, a thin layer(0003") of tin is electroplated on the surface of the copper. Tin will act as an etch resist in a future manufacturing process."
镀锡：镀铜后在铜表面再镀上一层锡，大约3mil厚，在下工序中起到抗蚀保护线路的作用。
Tin plating: Immediately after copper plating, a thin layer(0003") of tin is electroplated on the surface of the copper. Tin will act as an etch resist in a future manufacturing process."
镀锡：镀铜后在铜表面再镀上一层锡，大约3mil厚，在下工序中起到抗蚀保护线路的作用。
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