Study and select the new components of ESD protection.
研究并选择有关静电保护的新元器件。
Figure 1 shows one unsatisfactory approach to ESD protection.
图1显示一种不令人满意的方法实现ESD保护。
Multiple protection, ESD protection, implementation work 24 hours 7 days.
多重保护措施，具有ESD保护，实现7天24小时全天候工作。
These pins must be connected to external ground as the ESD protection circuit.
这些针脚必须连接到外部地面作为ESD保护电路。
So, there is an urgent need for more effective and reliable ESD protection circuits.
因此，需要采取更加有效而且可靠的ESD保护措施。
An ESD protection circuit for IC CARDS is described, which is based on CMOS process.
介绍了ESD保护结构的基本原理，并提出一个基于CMOS工艺用于IC卡芯片的保护电路。
The invention relates to an arrangement for improving the ESD protection in an integrated circuit.
本发明涉及一种设备，用于改善集成电路中的ESD保护。
To fabricate the ESD protection circuits without adding extra steps or masks into the CMOS process.
另外，在一些前人设计的ESD防护电路中，尤其是在。
The internal thermal protection and ESD protection ensures the stability of the chip under tough circumstance.
芯片内置的过温保护及esd保护可保证芯片在恶劣工作条件下的稳定性。
An ESD protection structure formed with lateral SCR is proposed. Equivalent circuit and layout are also given.
文章采用横向晶闸管设计ESD保护电路结构，给出了保护结构的版图以及等效电路。
A simulation method for ESD protection structure is presented in the paper by utilizing lumped-parameter circuit.
文章提出了一种通过集总参数电路对ESD保护结构进行模拟的方法。
Also to perform disconnection of ESD protection device from input pad once the packaged chip is placed in system.
当封装芯片置于系统中时，还完成将ESD保护装置从输入焊盘断开。
So the given ESD protection circuit using transistor delay can be well applied to VDD-to-VSS ESD protection in CMOS IC.
该保护电路不会导通。因此这种利用晶体管延时的保护电路完全可以作为CMOS集成电路电源和地之间的ESD保护电路。
Both the power and temperature distributions of an ESD protection structure during an ESD event are obtained using HSPICE.
利用HSPICE电路模拟软件，对ESD保护结构进行了集总参数模拟，获得了保护结构在ESD事件中的功率和温度分布。
A dynamic gate floating ESD protection circuit is first analyzed and then designed according to the whole-chip ESD planning.
本文研究了一种基于动态栅极悬浮技术的ESD保护电路，并根据全芯片ESD防护的要求设计了试验电路。
Effects of some key design parameters on the performance of the ESD protection circuit are discussed and physically explained.
讨论了一些重要的设计参数对ESD保护电路性能的影响并进行了物理上的解释。
Our products include power management circuits, interface circuits, power supplies, analog switches, ESD protection IC, and EMI filters.
公司产品包括电源管理电路、接口电路、模拟开关、静电保护器、电滋干扰滤波器。
In recent years, there is a large improvement on the luminous efficiency of LEDs. However, there are some problems in LED ESD protection.
近年来，氮化镓基led在发光效率上有很大的进展，不过在静电防护上却还有很大的改善空间。
The key problem originates from the complex interaction between the ESD protection circuitry and the core RF IC circuit under protection.
产生这一挑战的关键原因在于ESD保护电路和被保护的RFIC核电路之间存在着不可避免的复杂交互影响效应。
Four modules are included in the SPDT analog switch, for example, MOS switch circuit, driver circuit, buffer circuit, and ESD protection circuit.
单刀双掷模拟开关电路的设计包括四个模块：MOS开关电路、驱动电路、缓冲电路和ESD保护电路。
Then, the paper elaborates the design principles of RF front-end circuit, including high efficient rectifier, modulation circuit, demodulation circuit and ESD protection.
然后本文详细阐述了射频前端电路设计原理及过程，包括高效倍压整流电路、调制电路、解调电路和ESD保护电路。
After analyzing the basic principle of Electrostatic Discharge, the limitation of traditional ESD protection circuits applied in high speed circuits was pointed out in the paper.
分析了静电放电(esd)保护的基本原理，指出了传统的用于模拟电路的ESD保护电路在高速电路应用中的局限性。
The on-chip-ESD protection may be all that's necessary to see an IC safely from its manufacturer to a board assembler if both organizations adhere to strict anti-ESD-handling procedures.
如果其结构连接严格的抗ESD处理程序，对制造商而言，片上ESD保护板装配的IC安全是必要的。
This paper presents some new ESD protection structures for RF ICs, including dual-direction and all-mode ESD protection structures, and key aspects on ESD protection design are discussed.
本文介绍了几种新颖的低寄生、紧缩型、多模式射频集成电路ESD保护结构，讨论了其工作原理及设计中应注意的问题。
Three common power bus ESD protection structures in CMOS IC were discussed, the circuit structure and working theories were analyzed, an improved power bus ESD protection structure was put forward.
讨论了三种常见的CMOS集成电路电源总线esd保护结构，分析了其电路结构、工作原理和存在的问题，进而提出了一种改进的ESD保护电源总线拓扑结构。
The necessity and basic idea of electrostatic protection in assembling electronic devices are presented by introducing the electrostatic and electrostatic discharge(ESD)briefly.
通过对静电及静电放电（ESD）的简单介绍，提出了在电子装联中进行静电防护的必要性和基本思路。
The smaller feature size and the new appeared structures bring some new problems. The design of electrostatic discharge (ESD) protection devices becomes more and more different.
但是在器件特征尺寸的缩小以及新颖结果的出现的同时，不可避免的会带来一些负面的影响，其中静电放电保护器件的设计就变得越来越困难。
Part 2 is ESD protective technology. Introduce the necessity, the purpose, the control and system composition of electrostatic protection.
第二部分主要介绍静电防护的必要性、静电防护的目的与途径、静电防护的过程控制、静电防护系统的构成。
Thus, the voltage across ESD-protection diode D1A or D1B approaches 0V, and neither diode's leakage current affects the sensor's output signal.
因此，电压经过ESD保护二极管D1A和D1B接近0V，二极管漏电流均不影响传感器输出信号。
Protection of Components and Circuits Sensitive to ESD Transients Occurring on Power supplies, Control and Signal Lines.
保护元件和电路，防止在电源供应、控制和信号线产生的ESD。
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