Often used as curing agents in epoxy compounds.
常被用作环氧树脂固化剂的化合物。
Amines. Often used as curing agents in epoxy compounds.
胺。常被用作环氧树脂固化剂的化合物。
For example, epoxy compounds can heal surfaces if they get cut - in just the same way that a scab forms if skin gets cut.
例如，环氧化合物可以在割开后修复表面——就像是皮肤割开后愈合那样。
Epoxy are synthetic resins formed by reactions of compounds containing epoxy groups.
环氧树脂是化学合成的树脂，它由含环氧基的化合物反应而成。
Organic compounds. A structure sometimes used in curing agents in Epoxy powder coatings.
有机化合物，一种应用在环氧粉末涂料作为固化剂使用的一种化学结构。
We applied the Compounds to alkyd resin varnish, epoxy resin (e? 44) and cotton cloth to test their flame resistance.
将这三个系列化合物分别应用于醇酸清漆，环氧树脂(E- 44)和棉布中进行初步阻燃性能测试。
By using polydimethylsiloxane containing epoxy groups as base gum, the compounds containing amino groups as crosslinking reagent, a new addition type curable silicone rubber were prepared.
以含环氧基聚二甲基硅氧烷为基胶，以胺类化合物为固化交联剂进行了新型加成型硫化硅橡胶的研究。
The epoxy molding compounds (EMC) was prepared by hot pressing molding method.
采用热模压法制备了环氧模塑料（EMC）。
The problem of crack initiation in epoxy resin sealing compounds at low temperature is discussed in this paper.
针对如何解决环氧树脂灌封料在低温下易产生开裂这一问题进行了探讨。
The recent research and development of the high performance epoxy molding compounds are summarized in the present paper.
本文综述了近年来国内外在高性能环氧树脂电子封装材料方面的研究与进展情况。
A new production method of green electrical packaging material, which can resist fire and crack epoxy resin sealing compounds was introduced.
介绍了电子封装材料绿色阻燃耐开裂环氧树脂灌封料的生产新方法。
The flame retardance in epoxy E-44 was discussed as well, and the flame retardance of the compounds of sulfur containing and not containing have been compared.
并将磷酰苯肼和相应的硫代磷酰苯肼在环氧树脂(E - 44)中的阻燃性能进行了对比试验，结果表明硫元素与磷、氮元素有协同作用。
Study on Latent Curing Agent of Epoxy Resin Sheeting Molding Compounds;
研究了玻璃粉／环氧树脂封接复合材料的制备与性能。
Study on Latent Curing Agent of Epoxy Resin Sheeting Molding Compounds;
研究了玻璃粉／环氧树脂封接复合材料的制备与性能。
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