The high density of electronics assembly has already bring up the new challenge to conventional wave soldering technology.
电子组装的高密度给传统波峰焊接技术提出了新挑战。
It is believed that JetPrinting will more be adopted in electronics assembly, and will also be a competitive solder-paste printing technology.
可以确信焊膏喷印将会被更多地应用于电子组装上，成为一种具有竞争力的焊膏印刷技术。
Publishing House of Electronics Industry, " Microcomputer Principle and Interface Technology" 8086 assembly language support system PDF.
电子工业出版社《微机原理与接口技术》8086系统汇编语言配套PDF。
Publishing House of Electronics Industry, " Microcomputer Principle and Interface Technology" 8086 assembly language support system PDF.
电子工业出版社《微机原理与接口技术》8086系统汇编语言配套PDF。
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