However, the peak of field plate electronic field will increase with the drain voltage until device is breakdown.
而场板电场峰值则随着漏电压的增大不断增大，直至器件击穿。
Hence, it is a challenging task to accurately predict and characterize the breakdown process in a passive as well as an active electronic device or system.
因此，准确地估计和描述无源器件甚至是有源器件的击穿过程是一件非常有挑战性的事情。
The article first talk about on relevant laws and regulations, then summarized the experience of electrical and electronic equipment breakdown in reality.
本文研究了由相关法规探讨，总论在实际电机电子产品拆解测试之经验。
The article first talk about on relevant laws and regulations, then summarized the experience of electrical and electronic equipment breakdown in reality.
本文研究了由相关法规探讨，总论在实际电机电子产品拆解测试之经验。
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