• Its accuracy will influence the accuracy of LED die bonder.

    精度直接影响LED粘片精度。

    youdao

  • Die Bonder is manufacturing equipment which binds IC chip onto Lead Frame in semiconductor production.

    用于将IC芯片粘结到引线框架半导体器件生产专用装备

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  • IC Die Bonder is key equipment which binds semiconductor microchip onto Lead Frame in semiconductor back-end production.

    集成电路片机半导体晶圆上微芯片贴引线的半导体制造后工序关键性生产设备

    youdao

  • The auto Die Bonder for SOT - 23 transistor is a high - speed, high - precision, machinery electronics integrated equipment.

    23晶体管封装自动键合机高速高精度机电一体化精密设备。

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  • The image recognition system is the key component of realizing the automation of LED die bonder as well as its difficult part.

    图像识别系统实现LED粘片自动化关键部分也是难点

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  • This paper introduces the original struchure and principle of the bondhead device for high speed die bonder designed by author.

    本文介绍作者设计高速芯片焊接机焊头独特结构工作原理,并给出主要设计参数和计算公式。

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  • The experimental results indicate that the designed parallel mechanism can meet the working requirements of the IC die bonder and each performance index has reached the design standards.

    实验结果表明设计机构满足IC芯片粘片机工作要求各项性能指标达到了设计标准。

    youdao

  • An experimental platform of the IC die bonder has been manufactured, and parameters such as moving precision and position accuracy have been measured by using image recognition technology.

    设计制造IC芯片片机焊头机构实验平台,采用图像处理的方式来测量焊头的运动精度定位精度参数

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  • Mainly introduce the function of the eutectic bonder applied to high power die, the technology target, the structure of the machine and the electric control.

    本文主要介绍大功率管芯晶设备主要功能技术指标机械结构电气控制等。

    youdao

  • Mainly introduce the function of the eutectic bonder applied to high power die, the technology target, the structure of the machine and the electric control.

    本文主要介绍大功率管芯晶设备主要功能技术指标机械结构电气控制等。

    youdao

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