A perforated metal wafer carrier is also used for wafer bonding for easy handling and de-bonding.
穿孔金属晶片载体也用于晶片键合，用以容易地处理以及松解。
Some information on the progress of new techniques of nondestructive testing (NDT) applied in solid rocket motor propulsion and de-bonding of multiple interface is discussed in this paper.
文中阐述了无损检测新技术在固体发动机推进剂及多界面脱粘方面取得进展的部分情况。
The stress-strain curve under transverse loading of MMCs has a corner point, associated with the initiation of interfacial de-bonding, which is determined by the interfacial bonding strength.
在常响应界面情况下，复合材料横向拉伸应力-应变曲线存在明显的转折点，对应于界面分离的起始点，转折点的位置取决于界面粘结强度。
The stress-strain curve under transverse loading of MMCs has a corner point, associated with the initiation of interfacial de-bonding, which is determined by the interfacial bonding strength.
在常响应界面情况下，复合材料横向拉伸应力-应变曲线存在明显的转折点，对应于界面分离的起始点，转折点的位置取决于界面粘结强度。
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