The solder mask is configured on the dielectric layer and covers the circuit layer.
焊罩层配置在介电层上且覆盖线路层。
The circuit layer is contacted with the dielectric layer and is provided at least one gasket joint.
线路层接触介电层，且线路层具有至少一接垫。
The text on the solder mask layer is overlapping the text that on the circuit layer. We suggest move it away. Please refer to Q7.
绿油层上的字符与线路上的字符重叠在一起，建议将绿油层上的字符移开。请看Q7处。
The circuit board comprises a dielectric layer, a circuit layer and at least one electricity-conducting joint pole and a solder mask.
一种电路板，其包括介电层、线路层、至少一导电接合柱与焊罩层。
Please see below picture, those letters overlap at circuit layer and solder mask. We suggest deleting the letters in solder mask layer.
如图，那些字在线路和阻焊层都有，我们建议删除阻焊上的字。
The circuit board comprises a plurality of circuit layers, one power supply layer, a plurality of insulating layers and one conducting pattern.
此线路板包括多个线路层、一电源层、多个绝缘层与一导电图案。
Then a second circuit layer is formed on the insulation layer and the surface of the basic board, at last, the continuous process such as forming a welding cover.
及形成一第二线路层于该绝缘层上，其特征在于：所述绝缘层是通过进行一电泳沉积程序而形成于该第一线路层的外表面上，且所述绝缘层仅覆盖了该第一线路层；
For example, one layer contains the active material that releases an electron when it's struck by light and another layer contains the circuit that carries the current.
例如，放置活化材料的一层，当它被光照时，便会释放电子，而电路层则负责传送电子流。
In addition, the transport layer allows IMS devices to make and receive calls to and from the PSTN network or other circuit-switched networks via the PSTN gateway.
此外，传输层允许IMS设备通过PSTN网关呼叫PSTN网络或其他电路交换网络和接收来自这些网络的呼叫。
Over this layer, a photosensitive film layer is applied, and ultraviolet (UV) light is applied through the circuit pattern overlay.
过该层，感光膜层被施加，并且紫外线(UV)光通过电路图案叠加的应用。
Based on elementary circuit theorems, the matrix equations for calculating layer currents are set up and some formulas are deduced.
根据电路基本定律，列出了计算各层定流的矩阵方程并推导了有关的计算公式。
The device consists of cotton layer testing sensor, magnification and filter circuit, single chip processing system and performing unit.
该装置包括棉层横向不匀检测传感器、信号处理电路、单片机处理系统和执行机构等部分。
A method for forming a silicon oxide layer for use in integrated circuit fabrication is provided.
为形成了集成电路制造中使用的硅氧化层的方法提供。
Joining a engineering, this paper gives the high speed and low consuming circuit of network communication based on the microprocessor of S3C4510B, it takes DM9161 as a physical layer interface.
文章结合工程实例，基于S3C 4510 B微处理器构建了以DM 9161为以太网物理层接口的低功耗、高速硬件电路。
Electricity charges and discharges from the multi-layer cabling's parasitic capacitance when signal is transferred among different parts of integrated circuit.
通过集成电路各器件间的布线传递信号的过程，是将信号电荷向布线间形成的寄生电容充放电的过程。
An equivalent circuit of the dry - type transformer with subsection and layer winding applied transient voltage is brought forward.
提出了一种暂态电压下分段层式干式变压器线圈的等值电路。
The Operations, Maintenance and administration Part (OMAP) layer provides procedures related to database administration, circuit management, routing and validation.
运营，维护和管理部分(omap)层提供与数据库管理、电路管理、路由和验证相关的过程。
In the multi-layer circuit board manufacturing process, the laminating technology is an important aspect of the quality and reliability of laminated board carving the final quality plays a key role.
在多层电路板制造工艺中，层压技术是十分重要的一个环节，层压的质量和可靠性对电路板的雕刻最终质量起着关键的作用。
If this is the case the circuit manager may wish to filter out datagrams for the appropriate network layer if only one of the applications is affected.
在这种情况时，链路管理器可能为特定的网络层过滤数据包，而只使一个程序受影响。
Through using 16-bit freescale MCU embedded CAN controller as master chip in each node, it achieved the design of hardware circuit, so realized CAN physical layer and CAN data link layer.
各个节点设计上采用内置CAN模块的飞思卡尔16位单片机作为主控芯片来搭建硬件电路，以实现CAN总线的物理层和数据链路层。
A wiring and interlayer dielectric layer may be formed over the first substrate including the readout circuit.
可在包括读出电路的第一衬底上方形成布线和层间介电层。
A display apparatus including a circuit board and a surface grounded portion which is disposed on an end portion of the circuit board and formed of a conductive layer.
一种显示装置包括电路板和表面接地部分，该表面接地部分设置在电路板的端部分上并且由导电层形成。
With the circuit schematic design and the high speed PCB design, completes PCB composition, stackup design, internal layer design, system grounding design and high-speed signal line design.
在电路原理图设计中遵循高速信号电路PCB设计原则，完成了系统PCB的布局、叠层设计、内电层设计、系统接地设计和高速信号线等设计；
Part of the silicon layer was masked and dry etched with SF6 gas to allow connection of the current-collector to the outside circuit.
硅片的一部分经掩膜后进行SF6干法刻蚀，从而使集流器能够连接到外电路上。
The current popular multi-layer microwave circuit is one of the most important applications in the three-dimensional space technology.
目前流行的多层微波电路技术，正是三维空间电路技术重要应用之一。
The heat seal connector is made of coating layer that is consisted in conductive particulate dispersed in hot-melt adhesive on printed circuit polyester film.
热压密封连接器是在聚酯膜上印刷导电线路后，涂覆一层分散有导电微粒并具有热熔性的胶粘层而组成。
The relatively constant values of open circuit voltage suggest the electrolyte layer withstands thermal shock due to high thermal conductivity and excellent ductibility of the metal substrate.
相对恒定的开路电压显示，电解质层经受住了热冲击，此受益于金属支撑体良好的导热性和延展性。
A printing layer is arranged on one face of the touch-sensitive panel towards the circuit board and printed with corresponding key-press positions.
一印刷层，设置于该触控式面板与该电路板相对面的对应表面，并印刷有相应的按键位置；
In one embodiment for example, the ground surface 101 includes several inter-connected layers of the multi-layer circuit board.
在例如一个实施例中，地面101包括多层电路板的若干相互连接的层。
In one embodiment for example, the ground surface 101 includes several inter-connected layers of the multi-layer circuit board.
在例如一个实施例中，地面101包括多层电路板的若干相互连接的层。
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