The dynamics of ultrasonic transducer for thermosonic flip chip bonding is investigated.
研究了热超声倒装键合设备的核心执行机构——换能系统的动力学特性。
The embedded active chip also can be realized by backside thinning and flip chip bonding.
通过对芯片进行背面减薄和倒装连接，可以实现有源芯片的埋嵌。
The company also undertake external chip bonding, SMT, plug-in, assembly and other services.
同时公司还对外承接芯片邦定、贴片、插件、组装等业务。
This article presents acid could be used to wash the indium bumps before flip chip bonding, based on indium oxide dissolved in acid.
利用氧化铟易于溶于酸性溶液的性质，提出了在倒装焊接之前使用酸性溶液对铟柱进行酸洗。
This paper talks about the major supporting technologies for MCM package: the Interlinkage of Chips, Flip Chip Bonding, Flip Bonding.
本论文研究了MCM中芯片安装互连、芯片倒装焊接及其关键支撑技术等内容。
Thedrain saturation current is increased 10% after bonding. To disperse heat of GaNHEMT, this flip chip bonding method seems to be simple and effective.
实验结果表明，这种改进的倒装焊技术可以使HEMT 器件的饱和漏极电流提高10%。
This paper introduces the forward trends of flip chip bonding, the essential kinds of bumps, fabrication technology and testing technology about qualities.
介绍了芯片倒装焊的重要意义、发展趋势、基本的焊球类型、制作方法及焊球质量的检测技术。
With the Doppler laser vibration measurement system, the vibration velocity curves of the flip chip and tool tip were obtained during thermo-sonic flip chip bonding.
采用多普勒激光振动测量系统，获得了热超声倒装键合过程中工具末端及芯片的振动速度曲线。
Figure 7 shows the sequence for tape bonding the chip and assembling the package.
图7所示为带状引线连接芯片和管壳装配的工艺程序。
Bonding is one of key processes for fabrication of microfluidic chip.
键合是微流控芯片制作的关键技术之一。
The hot embossing and bonding machines have been used practically in microfluidic chip automatic fabrication, and the chips have satisfactory quality, precision, repetition and consistency.
塑料微流控芯片热压键合设备已经投入自动化生产，生产的芯片质量、精度、重复性和一致性良好。
The methods of 3d interconnection can be classified into the wire bonding, flip chip, through silicon via (TSV) and film wire technology, whose advantages and disadvantages are analyzed.
将实现3d互连的方法分为引线键合、倒装芯片、硅通孔、薄膜导线等，并对它们的优缺点进行了分析。
It proves that the designed parallel bonding mechanism meets the working requirements of IC Chip Die by these characteristic curves.
根据这些曲线，说明所设计的并联焊头机构能满足IC芯片粘片机的工作要求。
The bonding layer is adhered between the first chip and the second chip.
粘着层粘着于第一芯片与第二芯片之间。
In microelectronics, the process of connecting wires from the leads on the package to the bonding pads on the chip. Part of the assembly process.
在微电子中，使用电线将数据包的引线与芯片上的结合区相连接的过程。装配过程的一部分。
This paper introduces a fabricated method of using fused silica as the chip material. It includes standard photolithography, wet chemical etching and bonding techniques.
本文介绍了选用优质石英为芯片基体材料的一种制作方法，关键技术包括标准的光刻，湿法腐蚀，键合等微加工技术。
The loading structure, testing part and force sensors were all integrated on a single chip by bulk silicon technology and bonding process.
利用微机械体硅工艺及键合技术，把系统中的测试机构、加载机构以及力传感器集成在一个单一的芯片上。
This paper introduces how to recognize and locate the bonding pad from a silicon chip image with the method of Digital image Processing and Pattern Recognition.
介绍了采用图像处理和模式识别的方法对一幅半导体芯片的图像进行焊盘的识别和定位。
Bonding strength testing results showed that: the strength of PDMS mixture microfluidic chip was greater than 0.82mpa and the strength of the whole PDMS microfluidic chip was about 0.21mpa.
对键合成功的PDMS芯片强度进行测试，结果显示：PD MS混合微流控芯片大于0.82MPa，全pdms微流控芯片的键合强度约为0.21 MPa。
The third bonding wire is electrically connected between the second chip and the loader.
第三焊线电性连接于第二芯片与承载器之间。
Based on these characteristic curves, it proves that the moving stiffness of the designed Parallel Bonding Mechanism meets the working requirements of IC Chip Die.
根据这些曲线，说明所设计的并联焊头机构的动刚度能满足IC芯片粘片机的工作要求。
The first bonding wire is electrically connected between the first chip and the relay circuit base board.
第一焊线电性连接第一芯片与中继线路基板之间。
Electrostatic bonding is an important encapsulating means for the materials at the chip or wafer level. Reactions and bonding between glasses in an electric field were discussed in this paper.
静电键合是片状材料封接的一种重要手段，讨论了玻璃在电场作用下的键合过程。
A bonding pad with an RFID chip disposed thereon is arranged at the central area of the pair of extended conductive arms.
一置晶座和一射频识别(RFID)晶片设置在其上，位于该对导线臂的中心。
An IC chip is mounted by flip chip or wire bonding or adhesive connection on the face of the metal substrate which has the dielectric coating thereon.
IC芯片以倒装焊接或金属线焊接或粘贴连接安装于金属基片的有介质涂层的表面。
An IC chip is mounted by flip chip or wire bonding or adhesive connection on the face of the metal substrate which has the dielectric coating thereon.
IC芯片以倒装焊接或金属线焊接或粘贴连接安装于金属基片的有介质涂层的表面。
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