Bonding pressure imposition can be used as one of the methods modifying braze metal.
加压可以作为一种改性钎缝金属的方式。
The article analyzed the relations between the bonding pressure and the bonding strength through the experiment.
通过实验，研究了键合强度与键合压力间的关系。
In ultrasonic wire bonding process, the bonding pressure is one of the most important factors to the bonding strength.
在超声引线键合过程中，键合力是影响键合强度的重要因素之一。
The experiment showed that only when the bonding pressure in a moderate conditions can the largest bonding strength be reached.
实验发现，只有在键合压力适中的情况下，键合强度才能达到最大。
Research showed that: during the transient liquid phase diffusion bonding process, there exists a critical value about the choice of the bonding pressure.
研究表明：瞬时液相扩散连接中，压力的施加降低了液相的最大宽度，同时降低了降熔元素的总量，可以减少完成等温凝固所需要的时间。
Many factors impacting on its bonding reliability and the optimum parameters of bonding were studied, such as bonding temperature, curing time, bonding pressure, conductive particles fraction.
介绍各向异性导电胶导电机理和粘接工艺，以及影响它的粘接可靠性因素和最佳参数的研究，如粘接温度、固化时间、粘接压力、粒子含量等。
Via bonding mechanism, the importance of exerting pressure to the bonding interface between fiber sheets and concrete was indicated.
通过粘结机理说明用纤维布粘贴混凝土时施加压力的重要性。
Good quality andhigh efficiency: continuous bonding operation, high production efficiency, strong spring pressure, after bonding cloth smooth and firm and washing, nowrinkle.
品质好效率高：连续粘接式作业，生产效率高，强力弹簧加压，粘合后的衣料平整牢固，而洗涤，不易起皱。
Then, Via bonding mechanism, the importance of exerting pressure to the bonding interface between FRP and concrete was indicated.
通过粘结机理说明用FRP粘贴混凝土时施加压力的重要性。
In this paper, the curing pressure dependence of NBR-me-tal bonding of three common phenolic adhesives were studied.
本文研究了三种常用酚醛型粘合剂胶接nbr -金属模压件的固化压力依赖性。
Although the interface has the features of melt, and pressure welding, the molten and diffusion welding cannot explain the bonding mechanism of explosive welding.
实验表明，爆炸焊接界面虽然具有熔化、扩散和压力焊的特征，但不能用熔焊和扩散焊机理来解释爆炸焊接界面的成因。
Introduced the capacitive pressure microsensor produced by Si-Si bonding technology in terms of the practicality of MEMS products. The producing technology and major diagrams were given in detail.
从应用开发MEMS产品的实用角度出发，介绍了利用硅一硅键合技术制作的微型电容式压力传感器，给出了详细的制作工艺及主要工艺步骤图。
This paper describes the effects of various barks, reinforcing resins, keeping-time after lay-up and pressure on the bonding strength of plywood made from Masson pine bark adhesive.
本文探讨了用马尾松树皮胶压制室外型胶合板时，不同部位的树皮、不同增强剂、增强剂用量、单板涂胶后的陈放时间、热压压力等因素对胶合强度的影响。
The finite element method is used in the study of HNDT for bonding defects of polymeric substances under vacuum-pressure difference.
本文是在激光全息无损检测（简称HNDT）高聚物研究中，利用有限元计算方法，对其叠层粘接缺陷在真空负压载荷下形变量进行计算。
SOLARITE KM-4368-FR is a fire-retardant pressure sensitive adhesive. It was developed for the purpose of bonding a treated Teflon film to foil or polyester and glass fiber screen.
SolariteKM- 4368 -FR是一种阻燃型压敏粘合剂，用于将将处理过的聚四氟乙烯薄膜粘合到金属薄片或聚酯和玻璃纤维屏上。
The porous nano-structure is used as a bonding layer, and thermocompression bonding can be realized at lower temperature and pressure due to the nano-scale effect.
利用该多孔纳米结构作为键合层，由于纳米尺度效应，可以在较低的温度和压力下实现热压键合。
The influences of spinning speed, bonding area and roller pressure on the permeability performance of PET spun-bonded prefabricated vertical drain filters were tested and analyzed.
测试和分析了纺丝速度、轧点面积和轧辊压力对纺粘热轧滤膜透水率的影响。
In process parameters, the rf power and pressure affect the number, energy and composition of the basic elements, the substrate temperature effect the surface diffusion and atomic bonding.
工艺参数中，射频功率和压强综合影响了基元数量、能量以及成分，基片温度主要影响表面扩散、原子成键。
Diffusion bonding under pulsatile pressure is an ideal bonding method, which can accelerate diffusion, reduce the amount of intermetallic compound and improve its distribution.
脉冲加压扩散焊能促进扩散过程，减少金属间化合物的形成，改善其分布，是一种较有前景的扩散焊方法。
Taking advantage of advanced SEM and TEM technology and modern TFD theory, explanation to microscope bonding mechanism of cold pressure welding was made.
利用近代界面及表面电子结构理论(改进的TFD理论)和现代先进分析测试技术对冷压焊结合的微观机理进行了分析。
Bonding process of cold forming with ply pressure is introduced, and compared with hot-press approach.
介绍了叠压冷成型粘结法，且与热压法进行对比。
Bonding process of cold forming with ply pressure is introduced, and compared with hot-press approach.
介绍了叠压冷成型粘结法，且与热压法进行对比。
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