The whole bond slip curve and bond stress distribution along embedded length were measured by continuous automatic collection.
采用了连续自动的采集方式，测出了较完整的粘结滑移曲线以及粘结应力沿埋长的分布。
The whole bond slip curve and bond stress distribution along embedded length were measured by continuous automatic collection.
采用了连续自动的采集方式，测出了较完整的粘结滑移曲线以及粘结应力沿埋长的分布。
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