The embedded active chip also can be realized by backside thinning and flip chip bonding.

通过对芯片进行背面减薄和倒装连接，可以实现有源芯片的埋嵌。

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The embedded active chip also can be realized by backside thinning and flip chip bonding.

通过对芯片进行背面减薄和倒装连接，可以实现有源芯片的埋嵌。

youdao