In printed circuit board inspection system, automated optical inspection is more and more adopted.
在印刷电路板质量检测中，自动光学检测应用越来越普遍。
The part alignment is an important step for automated optical inspection of printed circuit board (PCB).
在印刷电路板的自动光学检测中，被检对象的空间对准是一个关键步骤。
The characteristics of image matching technology in the Automated Optical Inspection System are analyzed.
分析了自动光学检测中图像匹配技术的特点。
Because of the thermal distortion, the solder check position has be shifted during Automated Optical Inspection (AOI) for the PCB (Printed Circuit Board) assembled.
在组装的印制电路板自动光学检测中，由于印制电路板的热变形，造成检测中焊点位置的偏移导致测试失败。
The USL unit forms part of an automated line for inspection of assembled printed circuit boards, which includes automated optical, thermal and X ray testing as well as ultrasonic C scan examination.
USL负责的单元是在线检测印刷线路板，该系统包括光，热，及X射线检测，同时还有超声C扫描检测。
The USL unit forms part of an automated line for inspection of assembled printed circuit boards, which includes automated optical, thermal and X ray testing as well as ultrasonic C scan examination.
USL负责的单元是在线检测印刷线路板，该系统包括光，热，及X射线检测，同时还有超声C扫描检测。
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