综述了采用低成本的常规FR - 4层压板芯材和低介电常数高性能的半固化片形成的混合结构印制板，它具有较低的信号串扰和较低的成本。

This paper describes the hybrid-construction PCB were fabricated by the FR-4 laminate and high performance low-loss prepreg to achieve lower signal crosstalk and permit lower cost.

youdao

综述了采用低成本的常规FR - 4层压板芯材和低介电常数高性能的半固化片形成的混合结构印制板，它具有较低的信号串扰和较低的成本。

This paper describes the hybrid-construction PCB were fabricated by the FR-4 laminate and high performance low-loss prepreg to achieve lower signal crosstalk and permit lower cost.

youdao