采用三维封装结构取代传统的平面封装结构可获得高性能集成电力电子模块。
High performance can be obtained for the integrated power electronics module (IPEM) by using a three-dimensional packaging structure instead of a planar structure.
采用三维封装结构取代传统的平面封装结构可获得高性能集成电力电子模块。
High performance can be obtained for the integrated power electronics module (IPEM) by using a three-dimensional packaging structure instead of a planar structure.
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