“你所做的一切正是将(一台计算机)系统集成在单个芯片上”他说。
"All that you're doing is reducing (a computer) system to a single chip," he said.
单片机是将运算器、存储器、定时器、模数转换器和串行通信接口等集成在一个芯片上的小型计算机系统，它可以被嵌入到各种自动控制器和智能电子产品中。
Microcontroller is a small computer system that integrates ALU, memory, timer, ADC, UART, etc in one chip. it can be embedded into many kinds of controllers and intelligent electronic products.
趋势是将系统的存储器阵列和控制器电路一起集成在一个或一个以上集成电路芯片上。
The trend is to integrate the memory arrays and controller circuits of a system together on one or more integrated circuit chips.
随着集成电路制造工艺的飞速发展，人们已经可以将原先用各种电路搭建的板极系统集成在一块芯片上。
With the development of semiconductor process technology, nowadays a system on a PCB (Printed Circuit Board) which is composed of several ICs can be integrated into a chip.
该模糊控制器是可集成在一块芯片上的高速、低功耗系统。
The fuzzy controller is a high_speed, low power dissipation system that can be integrated in a single chip.
随着集成电路工艺的飞速发展，人们已经可以将原先的板级系统集成在一块芯片上，系统芯片逐渐成为集成电路设计的主流发展趋势。
With the development of semiconductor process technology a system on a PCB (Printed Circuit Board) which is composed of several ICs can be integrated into a chip.
现在的DSP属于第五代产品，它与第四代相比，系统集成度更高，将DSP芯核及外围组件综合集成在单一芯片上。
Now the fifth generation belonging to the DSP products, and its fourth generation, a higher degree of system integration, DSP cores and integrated peripheral components on a single chip.
测试芯片上的“系统”很多人已写了一个“片面系统”的概念，逻辑和模拟功能不断增长的集成在一个硅芯片或芯片。
Testing the "system on a chip" Much has been written about the concept of a "system on a chip," the ever-increasing integration of logic and analog functions on one silicon die or chip.
而现在最强大的单片机系统甚至可以将声音、图像、网络、复杂的输入输出系统集成在一块芯片上。
And now the most powerful single-chip microcomputer system can even voice, image, networking, input and output complex system integration on a single chip.
在一个实施例中，集成到芯片组102上的系统存储控制器106对中央处理器100提供通过互连110对系统存储器子系统108的访问。
System memory controller 106, integrated on chipset 102 in one embodiment, provides central processor 100 access to the system memory subsystem 108 through interconnect 110.
利用微机械体硅工艺及键合技术，把系统中的测试机构、加载机构以及力传感器集成在一个单一的芯片上。
The loading structure, testing part and force sensors were all integrated on a single chip by bulk silicon technology and bonding process.
利用微机械体硅工艺及键合技术，把系统中的测试机构、加载机构以及力传感器集成在一个单一的芯片上。
The loading structure, testing part and force sensors were all integrated on a single chip by bulk silicon technology and bonding process.
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