• 普通化学明显不同

    This is obviously different from the common electroless nickel plating.

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  • 公司化学镍磷领域拥有较高知名度产品远销海内外

    Companies in the field of electroless Ni-P has a higher profile, products sold at home and abroad.

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  • 以次亚酸钠还原剂压电陶瓷表面进行酸性化学

    Acid electroless nickel phosphorus plating on PZT ceramic was studied with hypophosphite as a reducing agent.

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  • 研究了空心玻璃微珠表面化学合金的无钯活化新工艺

    By this activation process, electroless nickel on cenospheres surface was carried out.

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  • 由于具有优良性能,化学镍磷合金工业得到了广泛应用。

    Electroless Ni-P alloy deposits have been widely adopted in industries for their excellent properties.

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  • 结果表明化学合金之后,试样疲劳寿命明显下降;

    The results show that the fatigue life of electroless Ni-P alloy specimen could be dropped.

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  • 由于具有优良性能,化学镍磷合金在工业上得到了广泛应用。

    Preparation of bulk amorphous Ni-P alloy by electrochemical deposition and its structure research;

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  • 化学镍磷合金具有很多独特理化性能然而由于成本较高限制应用

    Electroless nickel-phosphorus alloy deposit has many peculiar physical and chemical properties, yet its application is limited for high cost.

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  • 化学做为一门新型成熟表面处理技术受到人们越来越多的重视

    Chemical plating of nickel phosphorus film, as a new proven surface treatment technology, has drawn ever increasing attention.

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  • 本文45彩色化学镍磷成分工艺参数着色方法进行了比较深入的研究。

    Ingredients of the bath processing parameter and coloration method are studied deeply with respect to colored electroless Nickle plating on 45steel.

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  • AZ 91d镁合金首先酸盐溶液中化,然后硫酸盐镍磷合金。

    AZ91D Magnesium alloy samples were pretreated in zinc phosphating bath, and then were plated NiP deposits from the bath containing nickel sulphate.

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  • 化学镀镍合金工艺中使用一种新型光亮en6 5d,获得了全光亮的

    A new brightening agent EN65D is used in the electroless plating Nickel Phosioporuos process, and the entire bright coating is obtained.

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  • 本文采用电化学量子化学手段化学镀镍过程中析出机理影响因素进行了深入探讨

    Thus, electrochemical and quantum chemical methods were applied to deeply study phosphorus generation mechanism and influencing factors in this paper.

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  • 介绍钨硼(层、含复合含钨电刷层等研究与开发的近期进展。

    The paper present the new developments of Ni-W coat, Ni-W-B coat, tungsten composite coat and tungsten brush coat etc.

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  • 进而研究镍磷硬盘基片CMP中的抛光特性

    Then its CMP properties on hard disk substrate with nickel-phosphorous plated was studied.

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  • 研究酸性化学溶液中加速沉积速度析出层含层耐腐蚀性能的影响

    Effect of the speeding additive on deposition rate, hydrogen evolution amount, content of phosphorus and corrosion resistance of deposit in acidic electrolyte has been studied.

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  • 通过正交试验法优选出一种具有含量的快速化学工艺配方。

    An electroless nickel plating process with high deposition rate was optimized by orthogonal test.

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  • 介绍了化学镀镍-合金层的耐蚀特性及其石化工业上的应用

    The anti-corrosion characters of chemical nicklephospherous alloy planting and its application in petrochemical industry are introduced.

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  • 研究一种新型合金后处理工艺常温下。采用化学方法镍磷合金进行孔处理。

    A new post-treatment technique that Ni-P alloy coatings can be sealed at ambient temperature by chemical method has been investigated and developed.

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  • 传统化学工艺相比工艺所得硬度高,组织结构致密均匀

    Compared with conventional electroless nickel plating process, the deposits obtained are greatly improved with higher phosphorus content, hardness, more compact and uniform microstructure.

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  • 化学的反应机理出发,讨论了反应中影响沉积速率层中含量主要因素,试验制备了含量较高且抗蚀性良好的镍磷层。

    The chemical Ni P plating mechanism in acid baths and the major aspects which influence the plating rate and P content of Ni P alloy coatings were discussed.

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  • 不锈钢SUS301不锈钢条、线碳钢线、铁线线、青铜

    Stainless steel, SUS301 stainless steel, piano wire, carbon steel, nickel plating wire, iron wire, nail wire,. Phos-copper, bronze.

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  • 方法用于电极含量分析,测定结果相对标准偏差大于5.0%。

    The method was effective in analysing the content of nickel and phosphor of the platinized nickel electrode, and the relative error range to the standard was not more than 5.0%.

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  • 化学-合金液中加入硫酸铜制得--三元合金。

    Electroless nickel copper phosphorus ternary alloy deposits were prepared by addition of cupric sulfate in electroless nickel phosphorus alloy plating bath.

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  • 化学-合金液中加入硫酸铜制得--三元合金。

    Electroless nickel copper phosphorus ternary alloy deposits were prepared by addition of cupric sulfate in electroless nickel phosphorus alloy plating bath.

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