分析了氰化镀铜锡合金过程中镀层出现毛刺弊病的原因，并提出了解决方法。
The case of burrs defective in cyanide tin - copper alloy deposits were investigated and preventive methods were proposed.
介绍了电镀铜锡合金工艺的研究进展和应用、电镀铜锡合金镀液配方和工艺条件。
The research progresses and applications of Cu-Sn alloy plating process are presented, and the bath formulations and operational conditions of Cu-Sn alloy plating process are also introduced.
电镀铜锡合金是一种合适的代镍镀层，它不使人体过敏，能满足防扩散性能的要求，且成本较低。
Cu Sn plating is a right substitute for nickel coating because it is not allergic to human body, can meet anti diffusion requirement and has a lower cost.
采用硫酸铜、硫酸亚锡为主盐，加入络合剂、光亮剂、锡盐稳定剂，研究成功了一种新的浸镀铜锡合金工艺。
A new immersion plating process was developed in which copper sulfate and stannous sulfate were used as main salt, with addition of complex, brightener and stabilizer to tin salt.
采用正交试验研究了氰化镀铜锡合金工艺中各因素水平与镀液、镀层性能的关系，优选出一种最佳工艺配方。
A cyanide tin - copper plating process was optimized by means of orthogonal test. The effect of bath components of electrolytic solutions and electrodeposits was investigated.
例如钢基上镀铜、镍层再镀铬、低锡青铜上镀铬、多层镍上镀铬、镍铁合金镀层上镀铬等等。
For example steel base plated copper, nickel, chromium plating, low layer again tin bronze chrome, multi-layer nickel chrome plating nickel ferroalloy, chrome, and so on.
锡焊件、铅锡合金、锌压铸件、铍青铜、磷铜等合金在电镀前也常用预镀铜来改善结合力。
Tin welding parts and lead-tin alloy die casting, zinc, beryllium bronze, phosphorus copper alloy in electroplating copper with commonly used before also gets to improve adhesion.
研究了氧化锌、氧化亚锡两种固体微粒复合化学镀铜的工艺条件。
In this paper, the conditions of composite chemical copper plating with two solid particles ZnO and SnO are studied.
半自动滚镀铜、镍、银、锌、锡及无电解镀镍等。
Semi-automatic rolling copper, nickel, silver, zinc, tin, etc. and electroless nickel plating.
本文研究了在化学镀铜的聚酯纤维织物表面采用焦磷酸盐体系电沉积锡镍合金的工艺条件以及合金镀层织物的性能。
A soft electromagnetic shielding fabric was successfully prepared by electroplating tin-nickel alloy on the Cu-plated PET fabric in potassium pyrophosphate system.
镀锡：镀铜后在铜表面再镀上一层锡，大约3mil厚，在下工序中起到抗蚀保护线路的作用。
Tin plating: Immediately after copper plating, a thin layer(0003") of tin is electroplated on the surface of the copper. Tin will act as an etch resist in a future manufacturing process."
镀锡：镀铜后在铜表面再镀上一层锡，大约3mil厚，在下工序中起到抗蚀保护线路的作用。
Tin plating: Immediately after copper plating, a thin layer(0003") of tin is electroplated on the surface of the copper. Tin will act as an etch resist in a future manufacturing process."
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