• 从前有个男人,他城里乡间很精美房子,有着大量金盘盏,绣花罩着家具还有若干处处镀金的马车。

    THERE was a man who had fine houses, both in town and country, a deal of silver and gold plate, embroidered furniture, and coaches gilded all over with gold.

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  • 但是对于金牌,还要经历一道被称为镀金附加工序。事实上金牌4946黄金制造而成的。

    The gold MEDALS go through an extra step called the "bath of gold." the gold medal is actually made of 494 grams of silver and 6 grams of gold.

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  • 例如镀金卡柏线程出现材料

    New materials such as gilded cobber and silvery threads emerged.

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  • 介绍两种一次性镀金)件提取技术,并用自行研制的高效金设备应用于不同废镀件的处理。

    Two new technologies were introduced to extract gold(silver)in one step from waste gold plated articles. The extracting equipment was developed and successfully used for the purpose.

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  • 款可爱的鸟笼坠儿将欲展翅的蓝鸟镀金笼子里,好像把一个精致的美人迷人的包装里。

    Delicate beauty comes caged in a fascinating package in this adorable birdcage charm, complete with a bluebird swinging inside a gilded, sterling -silver cage.

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  • 我们采购化妆品情形工具情形,礼物盒子手表盒子,文具情形,激光唱碟情形,镀金的产品包装材料

    We want to buy Cosmetic Case, Tool Case, Gift Box, Watch Box, Stationery Case, CD Case, Silver Plated Products Packaging Materials.

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  • 来自18个岩溶黄色镀金制成具有充满活力的绿色翡翠娇小抛光一起其他真正钻石口音

    Made from sterling silver plated with 18-karat yellow gold, it features petite rounds of vibrant green emerald on one side, and polished silver dots along with a genuine diamond accent on the other.

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  • 提出镀金、镀铑工艺流程配方,介绍了金合金镀金工艺、镀前处理、操作要点,强调中间镀层有效防止基体腐蚀和镀件变色。

    To study the effect of surface treatment such as titanium nitrogen(TiN) coating and gold-plating on corrosion resistant of Ni-Cr alloy and Ni-Cr Alloy With Titanium.

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  • 着重介绍了电镀金金锡、锡、锡化学工艺过程,最后简单介绍了制备凸点的电镀设备

    Electroplating processes of Au, Au-Sn, Sn-Pb, Sn-Ag and chemical nickel-plated bumpings are described in particular. And finally, electroplating equipments for bumping formation are introduced.

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  • 着重介绍了电镀金金锡、锡、锡化学工艺过程,最后简单介绍了制备凸点的电镀设备

    Electroplating processes of Au, Au-Sn, Sn-Pb, Sn-Ag and chemical nickel-plated bumpings are described in particular. And finally, electroplating equipments for bumping formation are introduced.

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