配位共价键是其中两个键合电子均来自该键所涉及的原子之一的键。
A coordinate covalent bond is one where both bonding electrons are from one of the atoms involved in the bond.
这个这儿的区域指的的了键合区域。
本文介绍了一台自动引线键合装置。
分析了键合强度与键合温度之间的关系。
The relationship of bonding strength and temperature are investigated.
键合是微流控芯片制作的关键技术之一。
Bonding is one of key processes for fabrication of microfluidic chip.
引线键合是实现微波混合电路的关键技术。
Wire bonding is a critical technique for realizing microwave hybrid circuit.
键合空间理论是系统动力学键合图理论的拓展。
The Bond-space theory is the development of the bond graph theory of system dynamics.
结论：帕珠沙星以沟槽键合方式与DNA相互作用。
Conclusion: Pazufloxacin interacts with CT-DNA in the mode of groove binding.
超声功率是影响粗铝丝引线键合强度的最主要因素之一。
The influences of ultrasonic power on heavy aluminum wire wedge bonding strength were investigated.
BP网络用于金丝键合质量的预报具有可行性和有效性。
That BP network used for predicting quality of wire bonding is feasible and valid.
聚乙二醇键合相已用于高效疏水作用色谱分离活性蛋白质。
The polyethylene glycol (PEG) beaded phase has been employed for biologically active proteins by high performance hydrophobic interaction chromatography.
本文介绍了某微波组件芯片剪切力和键合强度的改进案例。
In this paper, an improvement example of die shear strength and bond strength of a microwave module is introduced.
这一模型和模拟结果对硅-硅直接键合设计有一定参考价值。
The model and the simulation results can be the reference in design of bonding process.
针对一种用键合线连接的简单封装模型进行射频性能的模拟。
The RF characteristics of bonding wire interconnection in a simple package model were simulated.
固体酸是将酸性基团键合或负载于不溶性载体上的一类催化剂。
Solid acids are a series of catalysts that acidic groups were bonded or supported on unsolvable supporters.
在超声引线键合过程中，键合力是影响键合强度的重要因素之一。
In ultrasonic wire bonding process, the bonding pressure is one of the most important factors to the bonding strength.
阐述了建立空间多体系统键合图模型的一般方法及其动力学原理。
The method of modeling spatial multibody systems by bond graphs and its dynamic principle are described.
科学家们忙于填补元素周期表的空白、探索未知的原子现象(如放射性和键合)。
Boffins were busily filling in the blanks in the periodic table and probing unknown atomic phenomena (like radioactivity and bonding).
本文简要描述了陶瓷外壳封装集成电路自动铝丝楔焊键合的工序检查。
This paper simply described the process inspection of automation Al wire ultrasonic wedge bonding in ceramic packaging IC.
认为这些平面氢键可以通过进一步键合来形成硬段微区中的三维氢键。
Three dimensional hydrogen bonding in hard segment domains can be formed by further bonding of the above planar hydrogen bondings.
但是，钛属于生物惰性材料，不能与骨组织形成化学键合或称骨键合。
However, titanium cannot bone-bond with bone tissue and was thought to be bioinnert.
气体等离子技术能够用于在引线键合前清洗焊盘以改进键合强度和成品率。
Gas plasma technology can be used to clean pads prior to wire bonding to improve bond strengths and yields.
介绍了三种典型的圆片键合强度表现形式：抗拉强度、剪切强度和粘接强度。
Three typical manifestations of wafer bonding strength were introduced as tensile strength, shear strength and adhesive strength.
硅片键合往往与表面硅加工和体硅加工相结合，用在MEMS的加工工艺中。
The silicon bonding technology is generally combined with surface silicon machining and bulk silicon machining in MEMS.
在MEMS器件的设计与加工过程中，键合技术是体硅工艺的一项关键技术。
In the design and fabrication of MEMS devices, MEMS fabrication process based on Silicon is a main technology, to which is deeply paid attention by researchers and industries.
以此为基础阐述了建立平面多体机械系统键合图模型的一般方法及其动力学原理。
Based on this, the generic procedure of modeling planar multibody mechanical systems by bond graphs and its dynamic principle are described.
这些实验现象和分析结果为后期的键合参数匹配规律和系统动态特性研究打下基础。
These experiment phenomena and analysis results are useful to the research of parameters match and dynamic feature of system in the future.
这些实验现象和分析结果为后期的键合参数匹配规律和系统动态特性研究打下基础。
These experiment phenomena and analysis results are useful to the research of parameters match and dynamic feature of system in the future.
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