于专为锡膏设计的设备中使用。
于专为锡膏设计的设备中使用。
Use only with production equipment specifically designed for use with solder paste.
勿使用其它金属成份接触锡膏。
锡膏厚度的测量顺序是否指定？
Is the sequence of Solder Paste height measurements defined?
通过研究，选择一种或两种无铅锡膏。
电铸产生的光滑孔壁也有助于锡膏释放。
Similarly, the smooth aperture walls produced by electroforming also enhance paste release.
您不需要为更换无铅锡膏而更改钢板设计。
You should not have to change your stencil design to accommodate the change to lead-free.
表面贴装，钢网是锡膏准确重复印刷的关键。
In surface mount assembly, the stencil is the gateway to accurate, repeatable solder paste deposition.
锡膏开封后在室温下建议于24小时内用完。
After being unsealed, the solder pastes should be completely used under a room temperature within 24 hours.
最明显的是，使用无铅锡膏必须提高回流焊温度。
The most obvious is the necessity for increased reflow temperature.
研究了焊粉粒度分布和氧含量对锡膏稳定性的影响。
Effect of particle size distribution and oxygen content of solder powder on the stability of solder paste were investigated.
在锡膏印刷过程中，印刷机是印刷品质控制的关键。
Screen printing equipment is the key of quality control during the printing course.
因此研究无铅锡膏在电子封装中的应用具有重要意义。
So study lead-free solder paste in the electronic application package is important.
本公司生产的有铅锡膏已采用符合无铅要求的助焊膏。
Soldering flux meeting the lead-free requirements is used for the lead-containing solder paste manufactured by our company.
比率低于66%，锡膏转移的效率降低，印刷质量变差。
As the ratio decreases below 66 percent, paste transfer efficiency decreases and print quality becomes erratic.
这项测试是与一些电阻和没有锡膏- 电阻不到位停留的原因。
This test is with some resistors and NO solder paste - the reason the resistors are not staying in place.
工艺的内在特性，导致孔内形成梯形断面，这有助于锡膏释放。
The intrinsic properties of the process result in apertures with a trapezoidal cross-section, which enhance paste release.
当焊盘面积大于孔壁表面积的66%。提高锡膏有效转移的可能性。
When the pad area is greater than 66 percent of the aperture wall surface area, the probability of achieving efficient paste transfer is increased.
采用锡膏搅拌机模拟锡膏使用过程，观察锡膏状态随搅拌时间的变化。
The use of solder paste was simulated by solder paste mixer and the variation on appearance of solder paste was observed.
对于钢网设计者来说非常重要的是面积比率。它直接与锡膏释放有关。
Of greater value to the stencil designer is the area ratio, which can be related directly to eventual solder paste release.
本文结合公司的生产实际，对无铅锡膏和无铅焊接工艺进行了系统研究。
This paper's actual production of lead-free solder paste and lead-free soldering process has been systematically studied.
三种焊锡膏均可形成饱满、光亮的焊点，锡铅焊点外观比无铅焊点更规整圆滑。
All of the three solder pastes could form plump and splendid solder point, and the appearance of Sn-Pb solder point was more regular and sleek.
在第二阶段，在优化设计区间中利用响应曲面法建立锡膏印刷过程的精确模型。
On the second phase, response surface method is adopted to build the accurate models in the reduced parameter ranges.
在锡膏印刷工艺中，锡膏、丝印机、锡膏使用方法和印刷工艺过程将影响到印刷质量。
Solder paste, screen printing, use ways, printing process course will decide the printing quality.
讨论了电子产品s MT制造过程中如何在产品高质量的基础上实现锡膏印刷的高生产量。
The paper discusses the SMT process of solder paste printing for electronic product with high throughput and high-quality.
回收废锡料：无铅焊锡回收、锡渣回收、锡条回收、锡线回收、锡膏回收、锡灰等废锡废铅回收。
Recycling waste tin material: lead-free solder recovery and recycling, tin tin slag the recycling, tin line recovery, solder paste recycling waste tin tin ash, such as waste lead recovery.
机器搅拌一般为1~3分钟，人工搅拌一般为3~6分钟（锡膏储存的时间越长，则搅拌时间越长）。
B. The mechanical mixing usually last 1 to 3 minutes, while manual mixing usually lasts 3 to 6 minutes (The longer time the solder pastes are kept, the longer time the mixing requires).
机器搅拌一般为1~3分钟，人工搅拌一般为3~6分钟（锡膏储存的时间越长，则搅拌时间越长）。
B. The mechanical mixing usually last 1 to 3 minutes, while manual mixing usually lasts 3 to 6 minutes (The longer time the solder pastes are kept, the longer time the mixing requires).
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