还原后可得到金属化率在90%以上的球团。
After the deoxidizing, the pellet has a metallization rate of 90%.
根据金属化率和还原度的定义，分析了二者之间的关系。
The relationship between metallization rate and reducibility is analyzed based onthe definitions of them.
根据这种关系可以判断金属化率和还原度测定值的某些偏差。
Some deviations can be judged of the measured value of metallizationrate and reducibility based on the relationship.
随着料高的增加，金属化率不断下降，然而气体利用率却在不断升高。
Metallization degree decreases while utilization degree of gas increases gradually with the height of charge increasing.
研究结果表明，还原温度和还原时间对还原铁粉的金属化率具有显著影响。
The results show that the reduction temperature and time have remarkable effect on the metallization rate of reduced iron powder.
结果表明：铁精粉制粒后、加入石灰石、无烟煤细磨后，金属化率大幅度提高。
It is showed from the result that with concentrate iron fines being grained, lime-rock added in and anthracite finely ground, the percentage metallization can get higher greatly.
成品球的金属化率与煤种性质关系密切，选用挥发分高的煤种对还原效果有利。
The metallization of finished pellets is close to the nature of the coal, it is beneficial effect on the reduction by use high volatile coal.
所得产品的铁品位、金属化率和铁回收率分别在90％、92％和84％以上。
The Fe content, metallization and iron recovery of the product are 90%, 92% and over 84%, respectively.
此炉子已经成功地用于铁精矿粉还原焙烧，所得到的海绵铁产品的金属化率大于92 %，全铁约90 %。
Continuous car type furnace was used in iron ore reduction successfully. The contents of with rotary hearth furnace are as more than 92% metallization and about 90% total iron.
通过实验研究了生产海绵铁工艺中 含铁料粒度、无烟煤粒度、石灰石用量与海绵铁金属化率之间的关系。
The relations between grain size of iron-bearing material and anthracite, amount of lime-rock and the percentage metallization in the process of DRI production are researched with experiments.
提高碳铁比可以提高成品球的金属化率，但微波还原过程中较低的碳铁比(0.32)仍可以获得相对较高的金属化率。
Improve the ratio of carbon-iron can increase the metallization of the finished pellets, however, the lower carbon-iron ratio (0.32) still can get a relatively high rate of metallization.
金属铜的电阻率低，所以在印制电路板中，用来制备铜箔及双面板、多层板的孔金属化方面采用镀铜工艺。
The resistance of the copper rate is low, so in printed circuit board, used to prepare copper foil and double panel, produce multilayer prototypes via metallization copper with on the process.
金属铜的电阻率低，所以在印制电路板中，用来制备铜箔及双面板、多层板的孔金属化方面采用镀铜工艺。
The resistance of the copper rate is low, so in printed circuit board, used to prepare copper foil and double panel, produce multilayer prototypes via metallization copper with on the process.
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