印制板试样必须经过MIL—P—55110标准浮焊试验，然后对金属化孔进行剖视。
PWB samples were subjected to the solder float test per MIL-P-55110 and then the PTHs were cross-sectioned.
多层印制板的制作是一个生产工序复杂且周期很长的过程，那么造成金属化孔镀层空洞的原因也就很复杂。
Making Multilayer printed board has a complex working procedure and long period, then the reason of causing Void PTH is very complex.
金属铜的电阻率低，所以在印制电路板中，用来制备铜箔及双面板、多层板的孔金属化方面采用镀铜工艺。
The resistance of the copper rate is low, so in printed circuit board, used to prepare copper foil and double panel, produce multilayer prototypes via metallization copper with on the process.
本文在简单介绍印制板孔金属化加工技术的基础上，对微波印制板孔金属化加工技术进行了较为详细的论述。
The technology of the plating through hole of the printed circuit board was briefly introduced the plating through hole technology of the microwave printed circuit board were also illuminated.
电镀铜是PCB加工过程中的一个关键工艺流程，涉及到孔和板面金属化的性能保证，影响因素众多。
The plating copper is a key process in the production of PCB, which involves the quality assurance of metallization of PTH holes and laminate surface, and is affected by a number of factors.
镀层延展性好，平整、外观良好，可用于印制线路板的孔金属化及其它塑料电镀。
It can be used to metalize holes of PCB and plate on plastics.
印制板的邮票孔是很普通的加工方法，但金属化邮票孔就不常见了。
The stamp hole on PWB is very common, but the PTH stamp hole is unusual.
印制板的邮票孔是很普通的加工方法，但金属化邮票孔就不常见了。
The stamp hole on PWB is very common, but the PTH stamp hole is unusual.
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