在蚀刻技术的每个阶段,固定高度的阻材料层会消失,暴露出不同部分的电路进行化学物质的侵蚀。
After each stage of the etching process a fixed depth of this is dissolved away, exposing a different part of the circuit to the etching chemicals.
在蚀刻技术的每个阶段,固定高度的阻材料层会消失,暴露出不同部分的电路进行化学物质的侵蚀。
After each stage of the etching process a fixed depth of this is dissolved away, exposing a different part of the circuit to the etching chemicals.
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