对一种先进的双悬臂梁高量程MEMS加速度计的单芯片封装工艺进行了失效机理分析。
Failure analysis is conducted for the single chip packaging process of an advanced high-range MEMS accelerometer with double cantilever beams.
失效分析是验证测试的重要方面，它为探求芯片失效机理与优化验证测试流程奠定了基础。
Failure analysis is a main aspect of the validation test and it provides the fundamental ways for tracing the failure mechanisms and optimizing the validation test flow.
通过对多芯片组件(MCM)的结构、失效模式和机理的分析，提出了适合我国生产实际的mcm失效率预计模型。
The structure, failure model and mechanism of MCM are analyzed and the failure rate prediction model for MCM is presented.
本文将主要讨论现阶段一般的封装失效分析的技术与设备，并且重点研究失效分析技术在多芯片封装领域的应用。
In this thesis, the application of the failure analysis in MCP package technology will be addressed along with some general fa instrument and methods.
去除塑料包封层，露出芯片表面，是DPA(破坏性物理分析)及FA(失效分析)的关键一步。
It is a crucial step for destructive physical analysis (DPA) and failure analysis (fa) to remove the plastic package for the die exposing.
通过分析发现了一般分析难以检测到的表面污染物污染、内部芯片断层等失效模式。
Based on the analysis, it discovers some failure modes, such as the chip surface pollutants and internal chip faults, that are difficult to be detected by the existing methods.
通过分析发现了一般分析难以检测到的表面污染物污染、内部芯片断层等失效模式。
Based on the analysis, it discovers some failure modes, such as the chip surface pollutants and internal chip faults, that are difficult to be detected by the existing methods.
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