其次，用试验找出符合力学模型的胶接固化工艺条件，并用试验验证用被粘材料的屈服强度估算接头能承受的最大拉伸力的合理性。
Thirdly, the optimum curing process parameters suitable with the mechanics model are found out and rationality of the estimated value is also validated by test.
中间灌注的防火胶液，经固化后为透明胶冻状与玻璃粘接成一体。
Fill with fireproof glue between glass chips, the fireproof glue will show itself clarity colloidal and connect two or more pieces of glasses after solidification.
采用环氧树脂-DDS固化体系作为胶接剂，探讨了各种金属表面处理方法、胶接时对胶接面施加的压力、胶层厚度等因素对胶接剪切强度的影响。
The influences of surface treatments, the pressures during bonding process and the thickness of adhesive layer on shearing strength were investigated with epoxy resin-DDS curing system as adhesive.
本文研究了三种常用酚醛型粘合剂胶接nbr -金属模压件的固化压力依赖性。
In this paper, the curing pressure dependence of NBR-me-tal bonding of three common phenolic adhesives were studied.
介绍各向异性导电胶导电机理和粘接工艺，以及影响它的粘接可靠性因素和最佳参数的研究，如粘接温度、固化时间、粘接压力、粒子含量等。
Many factors impacting on its bonding reliability and the optimum parameters of bonding were studied, such as bonding temperature, curing time, bonding pressure, conductive particles fraction.
对磷酸氧化铜无机胶套接扭剪试件在不同粘接表面状态，不同固化条件下的扭剪强度进行了系统测试，得出了对实际应用有价值的结论。
Under various adherent condition and solidify condition, the Torsional shear strength of the copper phosphate inorganic adhesive were tested. The results which are useful to application were obtained.
本文研究了固化时间与粘接强度的关系，而且应用红外光谱研究了第二代丙烯酸酯胶的固化机理。
In this paper, the relationship between the solidification time of SGA and its shear strength has been studied. On the other hand, solidification mechanism of SGA also has been studied by the IR.
本文研究了固化时间与粘接强度的关系，而且应用红外光谱研究了第二代丙烯酸酯胶的固化机理。
In this paper, the relationship between the solidification time of SGA and its shear strength has been studied. On the other hand, solidification mechanism of SGA also has been studied by the IR.
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