这组人员设计了一个反射和干涉系统，将激光分成两束，分别对准抛光硅晶片的两面，将两束光限制在硅当中。
By splitting a laser beam and aiming each part onto opposite sides of a polished silicon wafer, the group engineered a system of reflection and interference that traps both beams in the silicon.
本文介绍测量硅晶片应力的红外光弹系统及方法。
An infrared photoelastic system for measuring stresses in silicon wafers and its measurement method are presented in this paper.
本文介绍测量硅晶片应力的红外光弹系统及方法。
An infrared photoelastic system for measuring stresses in silicon wafers and its measurement method are presented in this paper.
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