膏组合物是用于在硅半导体基板(1)上形成电极(8)用的膏组合物，含有铝粉末、有机质媒介物和氢氧化物。
The paste composition is a paste composition for forming an electrode (8) on a silicon semiconductor substrate (1) and comprises an aluminum powder, an organic vehicle, and a hydroxide.
膏组合物是用于在硅半导体基板(1)上形成电极(8)用的膏组合物，含有铝粉末、有机质媒介物和氢氧化物。
The paste composition is a paste composition for forming an electrode (8) on a silicon semiconductor substrate (1) and comprises an aluminum powder, an organic vehicle, and a hydroxide.
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