电镀业循环过滤各类电镀液。
Electroplating industry circulation-filtering various plating solution.
还提供一种将无电电镀液施加至基板上的方法。
A method for applying an electroless plating solution to a substrate is also provided.
电镀液的定量补给；
电镀液的定量补给。
已经到达上端的电镀液穿过管状电极的通孔循环。
The plating liquid having reached the upper end circulates through the through-hole of the tubular electrode.
电镀时，镀层金属做阳极，被氧化成阳离子进入电镀液；
Electroplating, coating metal anode, was oxidized to cationic into plating solution;
解决电镀液中金属杂质含量较高，对电镀质量影响大的问题。
The electroplating liquid purifying device solves the problems that metal impurity content in electroplating liquid is high and influences electroplating quality very much.
本发明还提供了一种使用本发明的电镀液来形成彩色镀层的方法。
The invention also provides a method for forming color plating by using the electroplating solution of the invention.
以镍电镀液为分散介质，研究了几种典型类型表面活性剂的分散效果。
The dispersion effects of several typical kinds of surfactants on nickel electroplating bath were studied.
适用于PC b板含浸过程中遮蔽金手指部分和防止电镀液浸入及污染。
Used in the masking operation during wave solder process on PCB, prevented electroplating liquid immersing and polluting.
此法已被成功应用于测定锡-铜-铅合金电镀液及其镀层中的锡、铜和铅。
Cu and Pb ions in the alloy plating bath and composition of its deposits.
电流密度的变化的上限和下限是由电镀液的本性﹐浓度﹐温度和搅拌等因素决定的。
The change of the current density of the upper and lower specification limits by plating solution is the nature of concentration, temperature and stirring, factors such as the decision.
活性碳滤滤器特别用于电镀液，并且可以从液体中吸附有机杂质，除去多余的矿物质。
Activated carbon filters are especially used with electroplating baths, but also to absorb organic substances, remove foreign metals and regain precious metals from flushing water.
传统的镀铬工艺，其电镀液以铬酸为基础，以硫酸作催化剂，两者的比例为100：1。
The traditional process, the chrome plating solution the chromium acid as the foundation and sulfuric acid as catalyst, the ratio of 100 to 1.
结果表明：碳纳米管球磨后加入到镀液中，并通过超声分散，可以得到稳定的复合电镀液；
The results indicated that CNTs were stably suspended in nickel bath after ball-mill treatment and supersonic dispersion.
主要用于录音、录相带生产的磁浆过滤、化学溶剂、饮料、医药、化妆品、电镀液等的过滤。
Pure Polypropylene Filter Elements and Yarn Winding Filter Elements are mainly used for chemical, food and beverage, plating, electronic, pharmaceutical, petro-chemical, photographic industries etc.
研究了硫酸盐镍电镀液的组成及浓度，特别是糖精添加剂含量对电铸镍沉积层组织形貌和性能的影响。
The influence of the content of saccharin additive in sulphate bath on the microstructure and properties of Nickel deposit made by electric casting was investigated.
如一个金属零件加工厂，其金属件的电镀工艺委托外部的组织进行，那么组织应识别电镀外包方废水排放、废电镀液等；
As part of a metal processing plant, the pieces of metal plating technology by external organizations, the organization shall identify plating subcontractor wastewater, waste electroplating liquid;
圆管状间隙（S1）在放置在中空段内的管状电极与中空段的内周壁（14）之间形成，电镀液在该 间隙（S1）中流动。
A circular tube-like gap (S1) in which a plating liquid (17) flows is formed between the tubular electrode placed in the hollow section and an inner peripheral wall (14) of the hollow section.
本文介绍了国内无氰镀银研究情况，部分翻译了日本专利特开2000-192279，介绍银及其合金的无氰电镀液组分及工艺，镀液比较稳定。
JP-2000 192279, Cyanide-free electroplating bath for silver and silver alloy coating, using fatty sulphurous compounds that are stable for a relatively long time.
这两种方法都是在空隙被电解液填满之前对导电构架进行电镀。
In both cases these are electroplated onto the structure before the remaining gaps are filled with liquid electrolyte.
影响电镀质量的因素很多﹐包括镀液的各种成分以及各种电镀工艺参数。下面就其中某些主要因素进行讨论。
Many factors influence the quality of electroplating, including the various components of the solution and various electroplating process parameters. Here is some of the major factors are discussed.
稳定镀液和镀液的维护是保证电镀质量的必要条件。
Steadying and maintaining plating liquid is the essential condition of the guarantee to electroplate quality.
以提高电镀金刚石工具性能为目标，研究了稀土对亮镍镀液性能、镀层性能的影响及机理。
The goal is to improve the performance of bright nickel electroplated tools, and to analyze the influence of rare earths on bright nickel plating performance.
研究了从焦磷酸盐槽液中电镀锡镍合金的一种新工艺，讨论了一些电镀参数对锡镍合金镀层的影响。
A new technology of tin-nickel alloy electroplating from a pyrophosphating bath was studied. The effect of some plating parameters on the tin-nickel alloy coating was discussed.
镀液比重：基本上比重低，药水导电差，电镀效率差。
Solution: basically, the proportion of lower proportion potion is poor, poor efficiency conductive plating.
介绍了目前常用于电子元器件电镀纯锡液的主要技术要求。
Main technical requirements of pure tin plating bath common used for electronic component and device electroplating were introduced.
在电镀过程中，电解液也将随着改变，从而会使信号传感器给出错误的结果来。
The electrolyte would also be changed by the electroplating process and would cause the pickoff to give erroneous results.
综述了接插件连续镀金、、的电镀工艺，包括设备、液和镀层性质。
Summarizes continuous plating processes for electronic connector assemblies including gold, palladium and, tin plating solutions, properties of the films, and continuous plating equipment.
综述了接插件连续镀金、、的电镀工艺，包括设备、液和镀层性质。
Summarizes continuous plating processes for electronic connector assemblies including gold, palladium and, tin plating solutions, properties of the films, and continuous plating equipment.
应用推荐