电沉积过程中，钨酸根被还原成中间价态的氧化物。
Tungstate ions were reduced to oxide with intermediate valence.
电沉积过程中副反应很少，因此得到的金属质量很高。
Electro deposition processes very few side effects, so get the metal of high quality.
用旋转圆盘电极法研究了激光照射下铜的电沉积过程。
An electrodeposition process of copper under a laser beam was studied by using a rotating disk electrode.
论述了现代碱性光亮镀锌添加剂单体结构的新进展及对锌电沉积过程的作用机理。
New development of brighteners for alkaline zinc plating is reviewed with stresses on the advances in structure of monomers.
研究不同浓度甘氨酸对电沉积铁铬合金过程的影响，分析了甘氨酸在电沉积过程中的作用。
The influence of the glycine concentration during electrodepositing Fe-Cr alloy and the effect of glycine on electrodeposition were studied.
对于重金属电沉积过程中的极化现象，从理论与实验两方面进行了探讨，并确定了不同金属的还原峰电位。
Polarization phenomena of metals electro deposition are studied in both theory and experiments, and the reductive peak potentials of metals are also determined.
利用循环伏安、恒电位阶跃、电化学阻抗等电化学测试技术研究了电结晶初期以及电沉积过程的电化学行为。
The electrodeposited behaviours in the initial stage and deposited process were investigated by cyclic voltammetry(CV), chronoamperometry(CA), electrochemical impedance spectroscopy(EIS).
固体份在电沉积过程中被消耗，用作补充的组份称为补加漆料， 补加漆料包括高浓度的颜料浆和低粘度乳白色的树脂。
Solids are consumed during the deposition process. The components used are referred to as feed. Feed consists of a concentrated pigment paste and low-viscosity, milky-colored resin.
在研究碱性锡镍合金的电沉积过程中，讨论了镀液中各成分的含量、电镀工艺条件的改变及添加剂对锡镍合金镀层成分和外观的影响规律。
The effect of bath composition, operating conditions and additives on Sn content of electrodeposits during the process of Sn-Ni alloy electroplating in alkaline baths had been studied.
报道了以钨酸钠、硫酸钴和二亚硝酸二胺铂为主盐、以柠檬酸盐为络合剂电沉积钴铂钨合金的工艺过程。
A series of cobalt platinum tungsten alloys were deposited with sodium tungstate and cobaltous sulfate as the main salts and citrate as the complex agent.
按照所用金属原料在制备过程中的状态对多孔金属的制备工艺作了分类介绍，包括基于金属熔体的工艺、基于固态金属粉末的制备方法、基于电或化学沉积的方法。
According to the original state of raw metal material used in manufacturing, the manufacturing process can be classified as: melt-based process, powder-based process and deposition technology.
综述了铜在芯片微刻槽中电沉积填充的过程、机理 ，并着重讨论了实现无裂缝和无空洞理想填充的主要因素—镀液的组成和添加剂的影响。
The procedure and mechanism of copper filling in the trench of the chip are reviewed, the effect of electrolyte components and additives on superfilling are discussed.
综述了铜在芯片微刻槽中电沉积填充的过程、机理 ，并着重讨论了实现无裂缝和无空洞理想填充的主要因素—镀液的组成和添加剂的影响。
The procedure and mechanism of copper filling in the trench of the chip are reviewed, the effect of electrolyte components and additives on superfilling are discussed.
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